![](http://datasheet.mmic.net.cn/Microchip-Technology/PIC16C716-20I-SO_datasheet_99433/PIC16C716-20I-SO_91.png)
2005 Microchip Technology Inc.
DS41106B-page 89
PIC16C712/716
13.0
PACKAGING INFORMATION
13.1
Package Marking Information
*
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
18-Lead PDIP
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC16C716-04/P
0510017
XXXXXXXX
18-Lead CERDIP Windowed
XXXXXXXX
YYWWNNN
PIC16C
Example
716/JW
0510017
18-Lead SOIC (.300”)
XXXXXXXXXXXX
YYWWNNN
Example
PIC16C712-20
/SO
0510017
20-Lead SSOP
XXXXXXXXXXX
YYWWNNN
Example
PIC16C712
-20I/SS
0510017
Legend: XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
)
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e