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    參數(shù)資料
    型號(hào): PIC12LC508AT-04I/SM
    廠商: Microchip Technology
    文件頁(yè)數(shù): 76/113頁(yè)
    文件大?。?/td> 0K
    描述: IC MCU OTP 512X12 LV 8-SOIJ
    產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
    標(biāo)準(zhǔn)包裝: 2,100
    系列: PIC® 12C
    核心處理器: PIC
    芯體尺寸: 8-位
    速度: 4MHz
    外圍設(shè)備: POR,WDT
    輸入/輸出數(shù): 5
    程序存儲(chǔ)器容量: 768B(512 x 12)
    程序存儲(chǔ)器類型: OTP
    RAM 容量: 25 x 8
    電壓 - 電源 (Vcc/Vdd): 2.5 V ~ 5.5 V
    振蕩器型: 內(nèi)部
    工作溫度: -40°C ~ 85°C
    封裝/外殼: 8-SOIC(0.209",5.30mm 寬)
    包裝: 帶卷 (TR)
    配用: 309-1048-ND - ADAPTER 8-SOIC TO 8-DIP
    309-1047-ND - ADAPTER 8-SOIC TO 8-DIP
    其它名稱: PIC12LC508AT04ISM
    1999 Microchip Technology Inc.
    DS40139E-page 65
    PIC12C5XX
    11.0
    ELECTRICAL CHARACTERISTICS - PIC12C508/PIC12C509
    Absolute Maximum Ratings
    Ambient Temperature under bias ........................................................................................................... –40°C to +125°C
    Storage Temperature ............................................................................................................................. –65°C to +150°C
    Voltage on VDD with respect to VSS .................................................................................................................0 to +7.5 V
    Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V
    Voltage on all other pins with respect to VSS ............................................................................... –0.6 V to (VDD + 0.6 V)
    Total Power Dissipation(1) .................................................................................................................................... 700 mW
    Max. Current out of VSS pin .................................................................................................................................. 200 mA
    Max. Current into VDD pin ..................................................................................................................................... 150 mA
    Input Clamp Current, IIK (VI < 0 or VI > VDD)
    .................................................................................................................... ±20 mA
    Output Clamp Current, IOK (VO < 0 or VO > VDD)
    ............................................................................................................. ±20 mA
    Max. Output Current sunk by any I/O pin ................................................................................................................ 25 mA
    Max. Output Current sourced by any I/O pin........................................................................................................... 25 mA
    Max. Output Current sourced by I/O port (GPIO) ................................................................................................. 100 mA
    Max. Output Current sunk by I/O port (GPIO )...................................................................................................... 100 mA
    Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD -
    ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
    NOTICE: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device.
    This is a stress rating only and functional operation of the device at those or any other conditions above those
    indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
    extended periods may affect device reliability.