參數(shù)資料
型號： PHC223-2L1808-H
廠商： THOMAS BETTS CORP
元件分類： 插座
英文描述： PGA223, IC SOCKET
文件頁數(shù)： 2/2頁
文件大?。?/td> 140K
代理商： PHC223-2L1808-H
D
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
Need more technical information?
Consult your Thomas & Betts
sales office listed on the back cover
D17
Zero Profile Mylar
Carrier PGA Sockets
PHC Holtite Series
* Non-Accumulative
Contact
Holtite
Material
Part No.
& Finish
8134-HC-5P2
Berylliym Copper
(Gold)
Gold-Plated
8134-HC-5P3
Beryllium Copper
(Tin/Lead)
Tin/Lead Plated
8134-HC-27P4
Berylliym Copper
(Gold)
Gold-Plated
8134-HC-27P3
Berylliym Copper
(Tin/Lead)
Tin/Lead Plated
8134-HC-6P2
Berylliym Copper
(Gold)
Gold-Plated
8134-HC-6P3
Berylliym Copper
(Tin/Lead)
Tin/Lead Plated
HOLTITE PART NUMBERS / STANDARD CONFIGURATIONS
Recommended
Lead Size
Rectangular Lead
.011 x .018
± .002
(0,28 x 0,46
± .0,05)
or
Round Lead
.016 - .021
(0,406 - 0,533)
Diameter
Round Lead
.020 - .030
(0,51 - 0,76)
Diameter
Recommended
Primary
Drill Size
.0453
(1,15)
.0635
(1,61)
A Dim. Finished
Plated-Thru
Hole Size
.041
± .002
(1,05
± 0,05)
.058
± .002
(1,47
± 0,05)
B Dim.
Contact
Dia.
.044
± .0005
(1,12
± 0,01)
.0625
± 0.0005
(1,59
± 0,01)
C Dim.
Maximum
Profile
.100
(2,54)
.140
(3,56)
Board
Thickness
.030
(0,75)
Minimum
Plated-Thru
Hole Finish
.0003 - .0005
(0,0076 - 0,0127)
Electro-Deposited
Tin/Lead Over
.001
(0,0254)
Min. Thick
Electro Deposited
Copper Plate
Mylar
M
Mylar
M
Carrier Size
± .005"*
Carrier Size
± .005"*
10 X 10
1.175
15 X 15
1.675
11 X 11
1.275
16 X 16
1.775
12 X 12
1.375
17 X 17
1.875
13 X 13
1.475
18 X 18
1.975
14 X 14
1.575
DIMENSIONS
Option
Holtite
Recommended Lead Size
E
5P
.016" - .021" Diameter
L
27P
Low force version of 5P
.016" - .021" Diameter
F
6P
.020" - .030" Diameter
TABLE 1 - HOLTITE SELECTIONS
“M” Sq.
.100
(2,54)
.100
(2,54)
Removable
Carrier
Typical PCB
Socket
Terminals
-&.
$ , - H I & ' . @ A K L$HI&@JKBDim.ContactAreaDia.ADim.FinishedHoleDia.CDim.Max.ProfilePlatedThruHoleGlassEpoxySubstrate
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