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參數(shù)資料
| 型號(hào)： | PHC088-2E1327-H |
| 廠商： | THOMAS BETTS CORP |
| 元件分類： | 插座 |
| 英文描述： | PGA88, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 140K |
| 代理商： | PHC088-2E1327-H |
D
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
D16
Quality & Innovation From The
Product Group
PHC Holtite Series Zero Profile Mylar Carrier PGA Sockets
Part Number Example:
PHC068-2E1333-H
Number of
Contacts
Grid size
Holtite
Selection
(Table 1)
Plating Options
2 - Gold
3 - Tin/Lead
Footprint
Options
(Pg. D23)
P H C
H
FEATURES:
The PHC Series of Holtite Zero Profile pin grid solderless sockets are
designed to press fit into the plated through hole of a printed wiring board.
This unique design allows the plated through hole to become the component
socket. The elimination of soldering and insulator material gives the lowest
mounting profile possible for the pin grid array and the maximum visibility
to the circuit traces on the PCB for inspection and testing purposes.
Low insertion and withdrawal force contacts available
The profile of the printed wiring board with the Holtite contact installed
offers the lowest socketing profile, permitting card rack spacing as low
as .400" (10,16)
Precision machined, tapered entry, four-finger contact
Retains minimum component lead lengths
Maximum heat dissipation
Removes artwork design restrictions
Immediate conversion to the Holtite system
MATERIAL SPECIFICATIONS:
Carrier ............................ Mylar
Contact .......................... Beryllium copper
Plating ............................ Gold or tin/lead
HOW TO ORDER
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-202, Method 204, 20 G’s
Durabilty ........................ Passed MIL-STD-1344, Method 2016, 50 cycles
Solderability .................. Passed MIL-STD-202F, Method 208
pol. steel pin and .043" (1,09) plated thru hole
Withdrawal Force (5P) .. 103 Grams (3.6 oz.) average with .018" (0,46) dia.
pol. steel pin and .043" (1,09) plated thru hole
Contact Retention
in Board ...................... 7.5 Lbs. per line average
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-202, Method 106
Thermal Shock .............. Passed MIL-STD-202, Method 107, Cond. F
Operation Temperature .. Gold inner contact -55
°C to +125°C,
Tin/lead inner contact -55
°C to +105°C
Insertion Force (27P) .... 57 Grams (2.2 oz.) average with .018" (0,46) dia.
pol. steel pin and a .039" (0,99) plated thru hole
Withdrawal Force(27P) 30 Grams (1.1 oz.) average with .018" (0,46) dia.
pol. steel pin and a .039" (0,99) plated thru hole
For performance specifications on 6P Holtites, please consult factory
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