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參數(shù)資料
| 型號(hào)： | PEX8512RDK |
| 廠商： | PLX Technology, Inc. |
| 英文描述： | Flexible & Versatile PCI Express㈢ Switch |
| 中文描述： | 柔性 |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 1213K |
| 代理商： | PEX8512RDK |
into a backplane or motherboard. Figure 3 shows the
PEX 8512 in this application.
Quad GE
Quad GE
PEX 8512
x4
x4
x4
Figure 3. Aggregation Adapter Card
The adapter card in Figure 3 can be
transparent
, in which
case the PCI Express I/O devices are just standard I/O
endpoints such as Ethernet or Fibre Channel. Or the PEX 8512
can provide a
non-transparent
port to the system (via the
card’s edge connector). In this case, one of the PCI Express
devices can be a CPU or other “intelligent” device with on-
chip processing capability – thus needing address domain
isolation from the rest of the system. This approach is
commonly used in
RAID controllers
.
Intelligent Adapter Card
The PEX 8512 supports the
non-transparency
feature.
Figure 4 illustrates a host system using an intelligent adapter
card.
Intelligent I/O Adaptor
I/O
I/O
I/O
I/O
CPU
Non-Transparent
Port
Blade
CPU
Host
Primary
x2
x2
x2
x4
I/O
I/O
PEX 8512
NT
PEX 8533
x2
Figure 4. Intelligent Adapter Usage
In this figure, the CPU on the adapter card is isolated from the
host CPU. The PEX 8512 non-transparent port allows the two
CPUs to be isolated but communicate with each other through
various registers that are designed in the PEX 8512 for that
purpose. The host CPU
can dynamically re-assign both the
upstream port and the non-transparent port
of PEX 8512
allowing the system to be reconfigured.
Dual Host/Fabric Model
The
ExpressLane
PEX 8512 supports applications requiring
dual host
,
host failover
, and
load-sharing
applications
through the
non-transparency
feature. Figure 5 illustrates a
dual host system with dual switch fabric in dual-star
configuration.
The redundancy of the host and the fabric can be achieved
through many possible configurations using NTB function of
PEX 8512. In the configuration shown below the host 1
controls the switch 1 and associated I/Os and the host 2
controls the switch 2 and associated I/Os. The hosts and
switches are isolated using NTB functionality of PEX 8512 on
the host boards. If one of the hosts fails the surviving host can
remove the failing host from the configuration while
controlling both the switches and all I/Os. Similarly, if one of
the switches fails the host associated with that switch can send
control messages to its I/Os through the surviving switch using
NTB function.
Figure 5. Dual Host/Fabric Mode
Expansion Application
The PEX 8512 can also be utilized to expand the number of
PCI Express devices in a given system. Figure 6 shows how
the PEX 8512 can be used to double the number of ports
available from the Root Complex. Each port in the PEX 8512
is configured with a x4 link width. The Peer-to-peer
communication feature of the PEX 8512 allows the PCI
Express I/O devices to communicate with each other without
any centralized control.
Complex
Root
CPU
PEX 8512
x4
x4
Dual GE
x2
x2
PEX 8512
x4
x4
FC
x4
x4
x4
Slot
PCI Express
Dual GE
x2
x2
Dual GE
x2
x2
Dual GE
x2
x2
x2
Figure 6. Expansion Application
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| PEX8516 | Flexible & Versatile PCI Express Switch |
| PEX8516-BB25BI | Flexible & Versatile PCI Express Switch |
| PEX8516-BB25BIG | Flexible & Versatile PCI Express Switch |
| PEX8516RDK-1 | Flexible & Versatile PCI Express Switch |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PEX8516 | 制造商:PLX 制造商全稱:PLX 功能描述:Flexible & Versatile PCI Express Switch |
| PEX8516-AA25BI | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PCI SWITCH RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| PEX8516-AA25BI-G | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PCI Switch RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| PEX8516-BA25BI | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 16-lane PCI Switch RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| PEX8516-BA25BI G | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PCI Express Base 16 Lane Switch RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
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