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PDM41028
2
Rev. 2.2 - 4/29/98
Absolute Maximum Ratings
(1)
NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. Appropriate thermal calculations should be performed in all cases and specifically for
those where the chosen package has a large thermal resistance (e.g., TSOP). The cal-
culation should be of the form
: T
j
= T
a
+ P *
is average operating power and
θ
ja
the thermal resistance of the package. For this
product, use the following
θ
ja
values:
θ
ja
where T
a
is the ambient temperature, P
SOJ: 76
TSOP: 100
o
C/W
o
C/W
Symbol
Rating
Com’l.
Ind.
Unit
V
TERM
Terminal Voltage with Respect to V
SS
–0.5 to +7.0
–0.5 to +7.0
V
T
BIAS
Temperature Under Bias
–55 to +125
–65 to +135
°
C
T
STG
Storage Temperature
–55 to +125
–65 to +150
°
C
P
T
Power Dissipation
1.0
1.0
W
I
OUT
DC Output Current
50
50
mA
T
j
Maximum Junction Temperature
(2)
125
145
°
C
Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
CE
OE
Vss
Vcc
A6
A5
A4
A3
A2
A1
A0
NC
I/O3
I/O2
I/O1
I/O0
WE
25
26
27
28
Pin Description
Name
Description
A17-A0
Address Inputs
I/O3-I/O0
Data Inputs/Outputs
OE
Output Enable Input
WE
Write Enable Input
CE
Chip Enable Input
NC
No Connect
V
CC
Power (+5V)
V
SS
Ground
Truth Table
(1)
NOTE: 1. H = V
IH
, L = V
IL
, X = DON’T CARE
OE
WE
CE
I/O
MODE
X
X
H
Hi-Z
Standby
L
H
L
D
OUT
Read
X
L
L
D
IN
Write
H
H
L
Hi-Z
Output Disable
SOJ