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參數(shù)資料
| 型號： | PCF8574AT |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | I2C/I2S |
| 英文描述： | Remote 8-bit I-O expander for I2C-bus |
| 封裝： | PCF8574AP<SOT38-4 (DIP16)|<<http://www.nxp.com/packages/SOT38-4.html<1<Always Pb-free,;PCF8574AT/3<SOT162-1 (SO16)|<<http://www.nxp.com/packages/SOT162-1.html<1<wee |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 132K |
| 代理商： | PCF8574AT |
2002 Nov 22
21
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I
2
C-bus
PCF8574
13.4
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
7.
MOUNTING
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
DIPPING
suitable
suitable
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC
(5)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
(3)
suitable
not suitable
(4)
suitable
not recommended
(5)(6)
not recommended
(7)
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
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| PCF8574P | Remote 8-bit I-O expander for I2C-bus |
| PCF8574T | Remote 8-bit I-O expander for I2C-bus |
| PCH1632 | CHIP TYPE IMPEDANCE CONVERTER |
| PCH163250B | CHIP TYPE IMPEDANCE CONVERTER |
| PCH163250T | CHIP TYPE IMPEDANCE CONVERTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF8574AT | 制造商:NXP Semiconductors 功能描述:IC 8BIT I/O EXPANDER 8574 SOIC16 |
| PCF8574AT/3 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Remote 8-bit I/O expander for I2C-bus with interrupt |
| PCF8574AT/3,512 | 功能描述:接口-I/O擴展器 REMOTE I/O EXPANDER RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCF8574AT/3,518 | 功能描述:接口-I/O擴展器 EXTENDED I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCF8574AT/3,518-CUT TAPE | 制造商:NXP 功能描述:PCF8574 Series 2.5 - 6 V Remote 8-bit I/O Expander for I2C-bus - SOIC-16 |
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