- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄367816 > PCF50603 (NXP Semiconductors N.V.) Controller for power supply and battery management PDF資料下載
參數(shù)資料
| 型號(hào)： | PCF50603 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Controller for power supply and battery management |
| 中文描述： | 控制器電源和電池管理 |
| 文件頁數(shù)： | 25/28頁 |
| 文件大?。?/td> | 147K |
| 代理商： | PCF50603 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁當(dāng)前第25頁第26頁第27頁第28頁
2003 Oct 31
25
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
13.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar or manual soldering is suitable for PMFP packages.
2.
3.
4.
5.
6.
7.
8.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T
(3)
, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(5)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP
(8)
not suitable
not suitable
(4)
suitable
suitable
suitable
not recommended
(5)(6)
not recommended
(7)
not suitable
suitable
suitable
suitable
not suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCF50603HN | Controller for power supply and battery management |
| PCF50732 | Baseband and audio interface for GSM |
| PCF50732H | Baseband and audio interface for GSM |
| PCF7991AT | Advanced Basestation IC, ABIC |
| PCF80C31BH4-24H | CMOS single-chip 8-bit microcontrollers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF50603HN | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Controller for power supply and battery management |
| PCF50604HN/03/2C,5 | 制造商:NXP Semiconductors 功能描述:PMU FOR MOBILE PHONES - Tape and Reel |
| PCF50604HN/04/2C,5 | 制造商:NXP Semiconductors 功能描述:PMU FOR MOBILE PHONES - Tape and Reel |
| PCF50605HN/10E/N1, | 制造商:NXP Semiconductors 功能描述:PMU FOR SMARTPHONE, PDA & HDD - Tape and Reel |
| PCF50606HN/03A/N1, | 制造商:NXP Semiconductors 功能描述:PMU FOR SMARTPHONE, PDA & HDD - Tape and Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。