- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3776 > PCA9539PW,112 (NXP Semiconductors)IC I/O EXPANDER I2C 16B 24TSSOP PDF資料下載
參數(shù)資料
| 型號(hào)： | PCA9539PW,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 20/37頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | I²C Bus Fundamentals |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標(biāo)準(zhǔn)包裝： | 63 |
| 接口： | I²C，SM 總線 |
| 輸入/輸出數(shù)： | 16 |
| 中斷輸出： | 是 |
| 頻率 - 時(shí)鐘： | 400kHz |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-TSSOP |
| 包裝： | 管件 |
| 包括： | POR |
| 產(chǎn)品目錄頁面： | 825 (CN2011-ZH PDF) |
| 其它名稱： | 568-5025 935277298112 PCA9539PW PCA9539PW,112-ND PCA9539PW-ND |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁當(dāng)前第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁
PCA9539_PCA9539R
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 6 February 2013
27 of 37
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
14. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCA9698BS,118 | IC I/O EXPANDER I2C 40B 56HVQFN |
| PCA9555D,112 | IC I/O EXPANDER I2C 16B 24SOIC |
| PCA9555DB,112 | IC I/O EXPANDER I2C 16B 24SSOP |
| PCA9555PW,112 | IC I/O EXPANDER I2C 16B 24TSSOP |
| 5-531478-4 | CONT.MINI-LEAF STRIP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9539PW118 | 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 16BIT 400KHZ TSSOP24 |
| PCA9539PWE4 | 功能描述:接口-I/O擴(kuò)展器 16-Bit I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9539PWG4 | 功能描述:接口-I/O擴(kuò)展器 Rem 16B I2C & SMBus Low-Pwr I/O Exp RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9539PWR | 功能描述:接口-I/O擴(kuò)展器 16-Bit I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9539PWRE4 | 功能描述:接口-I/O擴(kuò)展器 16-Bit I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。