- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1959 > PCA9502BS,128 (NXP Semiconductors)IC I/O EXPANDER I2C/SPI 24HVQFN PDF資料下載
參數(shù)資料
| 型號： | PCA9502BS,128 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 14/25頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C/SPI 24HVQFN |
| 標(biāo)準(zhǔn)包裝： | 1,500 |
| 接口： | I²C，SPI |
| 輸入/輸出數(shù)： | 8 |
| 中斷輸出： | 無 |
| 頻率 - 時鐘： | 400kHz |
| 電源電壓： | 2.3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 24-HVQFN（4x4） |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | 935281363128 PCA9502BS-F PCA9502BS-F-ND |
PCA9502_3
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 03 — 13 October 2006
21 of 25
NXP Semiconductors
PCA9502
8-bit I/O expander with I2C-bus/SPI interface
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 20) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 18 and 19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 20.
Table 18.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 19.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCA9505DGG,118 | IC I/O EXPANDER I2C 40B 56TSSOP |
| PCA9507D,118 | IC I/O EXPANDER I2C 24B 8SOIC |
| PCA9534PW,112 | IC I/O EXPANDER I2C 8B 16TSSOP |
| PCA9535BS1,118 | IC I/O EXPANDER I2C 16B 24HVQFN |
| PCA9535EDWR2G | 16-BIT I/O EXPANDER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9502BS-F | 功能描述:接口-I/O擴展器 8-BITI/O EXPDR W/I2C-SPI INTRF RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9503A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Smart, simple solutions for the 12 most common design concerns |
| PCA9504A | 功能描述:接口 - 專用 GLUE CHIP 4 RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
| PCA9504ADGG | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Glue chip 4 |
| PCA9504ADGG,112 | 功能描述:接口 - 專用 GLUE CHIP 4 RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。