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參數(shù)資料
| 型號： | PCA8575 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Remote 16-bit I/O expander for I2C-bus with interrupt |
| 中文描述： | 遠(yuǎn)程16位I / O擴(kuò)展I2C總線的中斷 |
| 文件頁數(shù)： | 26/30頁 |
| 文件大?。?/td> | 168K |
| 代理商： | PCA8575 |
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PCA8575_1
NXP B.V. 2006. All rights reserved.
Objective data sheet
Rev. 01 — 30 November 2006
26 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 28
) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7
and
8
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 28
.
Table 7.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 8.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA8575BQ | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Remote 16-bit I/O expander for I2C-bus with interrupt |
| PCA8575BQ,118 | 功能描述:接口-I/O擴(kuò)展器 16-BIT I2C FM QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA8575BQ-T | 功能描述:接口-I/O擴(kuò)展器 16-BIT I2C FM QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA8575BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Remote 16-bit I/O expander for I2C-bus with interrupt |
| PCA8575BS,118 | 功能描述:接口-I/O擴(kuò)展器 16-BIT I2C FM QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
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