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參數(shù)資料
| 型號： | PCA84C886 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Microcontrollers for TV tuning control and OSD applications(應用于TV調頻和OSD的微控制器) |
| 中文描述： | 微控制器的控制和調整（應用于電視調頻和OSD的微控制器應用的電視OSD） |
| 文件頁數(shù)： | 68/72頁 |
| 文件大?。?/td> | 564K |
| 代理商： | PCA84C886 |
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1995 Jun 15
68
Philips Semiconductors
Preliminary specification
Microcontrollers for TV tuning
control and OSD applications
PCA84C646; PCA84C846
25 SOLDERING
25.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
25.2
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum (T
stg max
). If the printed-circuit
board has been pre-heated, forced cooling may be
necessary immediately after soldering to keep the
temperature within the permissible limit.
25.3
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
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