參數(shù)資料
型號: PC9RS08LA8CLF
廠商: Freescale Semiconductor
文件頁數(shù): 32/33頁
文件大?。?/td> 0K
描述: MCU 8BIT 8K FLASH W/ LCD 48-LQFP
標(biāo)準(zhǔn)包裝: 250
系列: RS08
核心處理器: RS08
芯體尺寸: 8-位
速度: 20MHz
連通性: SCI,SPI
外圍設(shè)備: LCD,LVD,POR,PWM,WDT
輸入/輸出數(shù): 33
程序存儲器容量: 8KB(8K x 8)
程序存儲器類型: 閃存
RAM 容量: 256 x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 6x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 48-LQFP
包裝: 托盤
MC9RS08LA8 Series MCU Data Sheet, Rev. 2
Electrical Characteristics
Freescale Semiconductor
8
3.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
The average chip-junction temperature (TJ) in
°C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C /W
PD = Pint + PI/O
Pint = IDD × VDD, Watts chip internal power
PI/O = Power dissipation on input and output pins user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
1 Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive (VDD) and negative (VSS) clamp voltages, then use the larger of the two
resistance values.
2 All functional non-supply pins are internally clamped to VSS and VDD except the RESET/VPP pin which is internally
clamped to VSS only.
3 Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum
current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD
and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater
than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are:
if no system clock is present, or if the clock rate is very low which would reduce overall power consumption.
Table 4. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJMAX
105
°C
Thermal resistance
Single layer board
48-pin LQFP
48-pin QFN
Four layer board
48-pin LQFP
48-pin QFN
θJA
71
84
49
28
°C/W
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