參數(shù)資料
型號: PC755BVZFU400LD
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 360PIN |塑料
文件頁數(shù): 40/48頁
文件大?。?/td> 276K
代理商: PC755BVZFU400LD
40/48
PC755B/745B
7.2. Parameters for the PC755B PBGA
7.2.1. Package parameter for the PC755B PBGA
The package parameters are as provided in the following list. The package type is 25 x 25 mm, 360-lead plastic ball grid array (PBGA).
Package outline
25 x 25 mm
Interconnects
360 (19 x 19 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.22 mm
Maximum module height
2.77 mm
Ball diameter
0.75 mm (29.5 mil)
7.2.2. Mechanical Dimensions of the PC755B PBGA
Figure 26 provides the mechanical dimensions and
bottom surface nomenclature of the PC755B, 360 PBGA package.
C
NOTES:
A. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
B. DIMENSIONS IN MILLIMETERS.
C. TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
0.2
B
C
C
360X
D
2X
A1 CORNER
E
e
0.2
2X
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
A
0.3
0.15
b
A
A1
A2
0.2 C
17 18 19
U
W
V
M
Millimeters
Min
2.22
0.50
1.00
0.60
25.00 BSC
25.00 BSC
1.27 BSC
DIM
A
A1
A2
b
D
E
e
Max
2.77
0.70
1.20
0.90
Figure 26 : Mechanical Dimensions and Bottom Surface Nomenclature of the PC755B PBGA
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