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參數(shù)資料
| 型號： | PC7447 |
| 廠商： | Atmel Corp. |
| 英文描述： | PowerPC 7457 RISC Microprocessor |
| 中文描述： | 7457的PowerPC RISC微處理器 |
| 文件頁數(shù)： | 14/66頁 |
| 文件大?。?/td> | 522K |
| 代理商： | PC7447 |
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14
PC7457/47 [Preliminary]
5345B–HIREL–02/04
Internal Package Conduction
Resistance
For the exposed-die packaging technology, shown in Table 4 on page 13, the intrinsic
conduction thermal resistance paths are as follows:
The die junction-to-case (actually top-of-die since silicon die is exposed) thermal
resistance
The die junction-to-ball thermal resistance
Figure 33 on page 58 depicts the primary heat transfer path for a package with an
attached heat sink mounted to a printed-circuit board.
Figure 4.
C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Note the internal versus external package resistance.
Heat generated on the active side of the chip is conducted through the silicon, then
through the heat sink attach material (or thermal interface material), and finally to the
heat sink where it is removed by forced-air convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the tem-
perature drop in the silicon may be neglected. Thus, the thermal interface material and
the heat sink conduction/convective thermal resistances are the dominant terms.
External Resistance
External Resistance
Internal Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Printed-Circuit Board
Radiation
Convection
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PC7447MG1000L | PowerPC 7457 RISC Microprocessor |
| PC7447MG1000N | PowerPC 7457 RISC Microprocessor |
| PC7447MG1200L | PowerPC 7457 RISC Microprocessor |
| PC7447MG1200N | PowerPC 7457 RISC Microprocessor |
| PC7447MG933L | PowerPC 7457 RISC Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC7447A | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC RISC microprocessor |
| PC7447AMGH1000LB | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC RISC microprocessor |
| PC7447AMGH1000NB | 制造商:e2v Aerospace & Defense 功能描述:MPU RISC 32-Bit 0.13um 1GHz 1.8V/2.5V 360-Pin HITCE CBGA 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.13UM 1GHZ 1.8V/2.5V 360HITCE CBGA - Trays |
| PC7447AMGH1000ZH4 | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.13UM 1GHZ 1.8V/2.5V - Bulk |
| PC7447AMGH1167LB | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC RISC microprocessor |
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