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參數(shù)資料
| 型號： | PC7410VGHU400N |
| 廠商： | Atmel Corp. |
| 英文描述： | PowerPC 7410 RISC Microprocessor Product Specification |
| 中文描述： | 7410的PowerPC RISC微處理器產(chǎn)品規(guī)格 |
| 文件頁數(shù)： | 13/54頁 |
| 文件大?。?/td> | 692K |
| 代理商： | PC7410VGHU400N |
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13
PC7410
2141D–HIREL–02/04
Internal Package Conduction
Resistance
Figure 4 depicts the primary heat transfer path for a package with an attached heat sink
mounted on a printed circuit board.
Heat generated on the active side of the chip is conducted through the silicon, then
through the heat sink attach material (or thermal interface material) and finally to the
heat sink where it is removed by forced-air convection.
Since the silicon thermal resistance is quite small, for a first-order analysis the tempera-
ture drop in the silicon may be neglected. Thus, the heat sink attach material and the
heat sink conduction/convective thermal resistances are the dominant terms.
Figure 4.
C4 Package with Heat Sink Mounted on a Printed Circuit Board
Thermal Management
Information
This section provides thermal management information for the ceramic ball grid array
(CBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent upon the system-level design – the heat sink, airflow and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods: adhesive, spring clip to holes in the printed-circuit board
or package and mounting clip and screw assembly; see Figure 5. This spring force
should not exceed 5.5 pounds of force. Ultimately, the final selection of an appropriate
heat sink depends on many factors such as thermal performance at a given air velocity,
spatial volume, mass, attachment method, assembly and cost.
Figure 5.
CBGA Package Cross-section with Heat Sink Options
External Resistance
External Resistance
Internal Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Printed Circuit Board
Radiation
Convection
Printed-Circuit Board
Adhesive or
Thermal Interface Material
Heat Sink Clip
Heat Sink
Option
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PC7410MGHU400N | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410VGHU450L | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410MGHU450L | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410VGHU450N | PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410MGHU450N | PowerPC 7410 RISC Microprocessor Product Specification |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC7410VGHU450L | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410VGHU450N | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410VGHU500L | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410VGHU500N | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7410 RISC Microprocessor Product Specification |
| PC7410VGSU400L | 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7410 RISC Microprocessor Product Specification |
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