參數(shù)資料
型號(hào): PC355
廠商: Sharp Corporation
英文描述: Mini-Flat Package, High Sensitivity Photocoupler
中文描述: 微型扁平封裝,高靈敏度光電耦合
文件頁(yè)數(shù): 5/6頁(yè)
文件大?。?/td> 74K
代理商: PC355
0
0.8
1.6
2.4
3.2
4.0
0
1.6
3.2
4.8
6.4
1mA
3mA
5mA
7mA
30mA
50mA
Forward current I
F
(mA)
10
%
90
%
Output
Input
Input
Output
R
L
V
CC
R
D
t
s
t
d
t
r
t
f
Test Circuit For Response Time
I
Temperature Profile of Soldering Reflow
(1) One time soldering reflow is recommended within the condition of temperature and time
profile shown below.
(2) When using another soldering method such as infrared ray lamp, the temperature may rise
partially in the mold of the device.
Keep the temperature on the package of the device within the condition of above (1).
Please refer to the chapter “Precautions for Use.”
G
30 seconds
230
C
200
C
180
C
25
C
2 minutes
1.5 minutes
1 minute
1 minute
Fig.13 Collector-emitter Saturation Voltage
vs. Forward Current
C
V
C
T
a
= 25C
I
C
= 0.5mA
PC355NT
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