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參數(shù)資料
| 型號： | PC33887VWR2 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | STEPPER MOTOR CONTROLLER, PDSO20 |
| 封裝： | LEAD FREE, PLASTIC, HSOP-20 |
| 文件頁數(shù)： | 22/32頁 |
| 文件大?。?/td> | 859K |
| 代理商： | PC33887VWR2 |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
29
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 26. Thermal Test Board
Device on Thermal Test Board
RθJA is the thermal resistance between die junction and
ambient air.
RθJS is the thermal resistance between die junction and the
reference location on the board surface near a center lead of the
package (see Figure 26).
EN
AGND
IN2
D1
CCP
V+
OUT2
D2
PGND
FS
V+
OUT1
FB
PGND
IN1
V+
1
2
3
4
5
6
7
8
9
10
20
19
16
15
14
13
12
11
18
17
Tab
33887 Terminal Connections
20-Terminal HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
A
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Table 8. Thermal Resistance Performance
Thermal Resistance
Area A (mm2)
°C/W
RθJA
0.0
52
300
36
600
32
RθJS
0.0
10
300
7.0
600
6.0
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