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參數資料
| 型號： | PC33887FC/R2 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | BRUSH DC MOTOR CONTROLLER, 6 A, PQCC44 |
| 封裝： | PLASTIC, QFN-44 |
| 文件頁數： | 21/24頁 |
| 文件大?。?/td> | 412K |
| 代理商： | PC33887FC/R2 |
33887
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
6
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Power Supply Voltage
Normal Operation (Steady-State)
Transient (Note 1)
VPWR(SS)
VPWR(t)
30
30-40
V
Input Voltage (Note 2)
VIN
7.0
V
FS Status Output (Note 3)
V FS
7.0
V
Continuous Output Current (Note 4)
IOUT(CONT)
6.0
A
ESD Voltage
Human Body Model (Note 5)
Machine Model (Note 6)
VESD1
VESD2
TBD
±200
V
Storage Temperature
TSTG
-65 to 150
°C
Ambient Temperature (Note 7)
TA
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Lead Soldering Temperature (Note 8)
TSOLDER
260
°C
Approximate Junction-to-Board Thermal Resistance (and package
dissipation) (Note 7), (Note 9)
HSOP (6.0 W)
QFN (1.5 W)
SO-EP (2.0 W)
RθJ-B
~5.0
~20
~15
°C/W
Notes
1.
Device will survive the transient overvoltage indicated for a maximum duration of 500 ms.
2.
Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device.
3.
Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device.
4.
Continuous output current capability so long as junction temperature is
≤ 150
°C.
5.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ).
6.
ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
7.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
8.
Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9.
Exposed heat sink pad plus the power and ground terminals comprise the main heat conduction paths. The actual RθJ-B (junction-to-PC
board) values will vary depending on solder thickness and composition and copper trace.
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