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參數(shù)資料
| 型號： | PALCE610H-25JC |
| 廠商： | LATTICE SEMICONDUCTOR CORP |
| 元件分類： | PLD |
| 英文描述： | USE GAL DEVICES FOR NEW DESIGNS |
| 中文描述： | EE PLD, 25 ns, PQCC28 |
| 封裝： | PLASTIC, LCC-28 |
| 文件頁數(shù)： | 6/14頁 |
| 文件大?。?/td> | 136K |
| 代理商： | PALCE610H-25JC |
2-387
PALCE610 Family
TYPICAL THERMAL CHARACTERISTICS
Measured at 25
°C ambient. These parameters are not tested.
Parameter
Symbol
Parameter Description
SKINNYDIP
PLCC
Unit
θjc
Thermal impedance, junction to case
21
20
°C/W
θja
Thermal impedance, junction to ambient
72
57
°C/W
θjma
Thermal impedance, junction to
200 lfpm air
64
47
°C/W
400 lfpm air
60
44
°C/W
600 lfpm air
55
40
°C/W
800 lfpm air
49
36
°C/W
Typ
ambient with air flow
Plastic
θjc Considerations
The data listed for plastic
θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the
θjc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore,
θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
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