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| 型號(hào)： | PACR6G |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | MOSFET N-CH 600V 4A TO-220FN |
| 中文描述： | 電磁干擾/ RFIT濾清器 |
| 文件頁(yè)數(shù)： | 1/3頁(yè) |
| 文件大小： | 99K |
| 代理商： | PACR6G |
2000 California Micro Devices Corp. All rights reserved.
7/17/2000
1
PACR6G
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
EMI/RFI T-Filter
Features
Highly integrated bus termination network
1% absolute tolerance terminations
Ultra-low crosstalk
18 terminating lines in QSOP package
Saves board space and improves system reliability
Reduces assembly cost and rework
Product Description
High speed microprocessors like Intel’s Pentium
Pro
Processor, demand unique, high speed bus termination
schemes. The PACR6G series network provides 18
terminations per package. Four termination resistor
values are available. The 47, 50 and 56 ohm termina-
tions are suitable for use with the Intel server chip set
and the 68 ohm termination is suitable for use with the
Intel desktop chip set. The tight resistor tolerance
minimizes noise contribution from termination
mismatching.
The PACR6G network offers high performance, high
reliability, and low cost through manufacturing efficiency.
It meets or exceeds all Intel specifications for termina-
Applications
Pentium
Pro servers & desktop systems
Engineering workstations
Embedded processor systems
GTL, ECL, NTL, HSTL terminator
C0970500
SCHEMATIC CONFIGURATION
tion performance and provides an additional degree
of system noise margin. The termination resistor
elements are fabricated using state-of-the-art thin film
manufacturing. This highly integrated solution is silicon-
based and has the same reliability characteristics as
any of today’s microprocessor products. The thin film
resistors
have excellent stability over temperature,
over applied voltage, and over product life. In addition,
the QSOP industry standard packaging is easy to
handle in manufacturing and provides interconnect
reliability — on par with other common semiconductor
components — and far better than traditional thick film-
based chip products.
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