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參數(shù)資料
| 型號(hào)： | PACDN2404C |
| 廠商： | California Micro Devices Corporation |
| 英文描述： | ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| 中文描述： | 靜電放電保護(hù)陣列，芯片級(jí)封裝 |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 52K |
| 代理商： | PACDN2404C |
PACDN2404C
PACDN2408C
PACDN2416C
2000 California Micro Devices Corp. All rights reserved.
1
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
ESD Protection Arrays, Chip Scale Package
Features
4, 8, or 16 transient voltage suppressors in a
single package
In-system Electrostatic Discharge (ESD)
protection to 18kV contact discharge per
IEC 61000-4-2 international standard
Compact Chip Scale Package (0.65mm pitch) format
saves board space and eases layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages
Product Description
The PACDN2404C, PACDN2408C and PACDN2416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD. The back-to-
back zener connections provide ESD protection in cases
where nodes with AC signals are present.
These devices are designed and characterized to safely
dissipate ESD strikes at levels well beyond the maxi-
mum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact discharge).
All I/Os are rated at 18kV using the IEC 61000-4-2
Applications
ESD protection of I/O port connections,
such as cellular phone, PDA, internet appliance
and PC ports
Protection of interface ports or IC pins which are
exposed to high levels of ESD
ESD protection of analog video and audio R, L, V
(right, left, video) ports
C1230700
contact discharge method. Using the MIL-STD-883D
(Method 3015) specification for Human Body Model
(HBM) ESD, all pins are protected for contact discharges
to greater than 30kV.
The Chip Scale Package format of these devices enable
extremely small footprints that are necessary in portable
electronics such as cellular phones, PDAs, internet
appliances and PCs. The large solder bumps allow for
standard attachment to laminate boards without the use
of underfill.
SCHEMATIC DIAGRAMS
PACDN2404C
PACDN2408C
PACDN2416C
A1
B1
A2
B2
A3
B3
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
C1
D1
C2
D2
C3
D3
C4
D4
C5
D5
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N
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R
C
4
0
4
2
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A
P
2
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相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PACDN2404CR | ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2416C | ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2416CR | ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN3401C | TRANSIENT VOLTAGE SUPPRESSOR, SINGLE 5V, 0402 SMD |
| PACDN3401CR | TRANSIENT VOLTAGE SUPPRESSOR, SINGLE 5V, 0402 SMD |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PACDN2404CR | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2408C | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2408CR | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2416C | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2416CR | 制造商:CALMIRCO 制造商全稱:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
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