參數資料
型號: P89LPC935FHN,151
廠商: NXP Semiconductors
文件頁數: 52/77頁
文件大小: 0K
描述: IC 80C51 MCU FLASH 8K 28HVQFN
產品培訓模塊: Migrating from 8/16-Bit MCUs to 32-Bit ARMs
標準包裝: 490
系列: LPC900
核心處理器: 8051
芯體尺寸: 8-位
速度: 12MHz
連通性: I²C,SPI,UART/USART
外圍設備: 欠壓檢測/復位,LED,POR,PWM,WDT
輸入/輸出數: 26
程序存儲器容量: 8KB(8K x 8)
程序存儲器類型: 閃存
EEPROM 大?。?/td> 512 x 8
RAM 容量: 768 x 8
電壓 - 電源 (Vcc/Vdd): 2.4 V ~ 3.6 V
數據轉換器: A/D 8x8b; D/A 2x8b
振蕩器型: 內部
工作溫度: -40°C ~ 85°C
封裝/外殼: 28-VQFN 裸露焊盤
包裝: 托盤
產品目錄頁面: 706 (CN2011-ZH PDF)
配用: 622-1014-ND - BOARD FOR LPC9XX TSSOP
622-1008-ND - BOARD FOR LPC9103 10-HVSON
622-1006-ND - SOCKET ADAPTER BOARD
568-4000-ND - DEMO BOARD SPI/I2C TO DUAL UART
568-3510-ND - DEMO BOARD SPI/I2C TO UART
622-1002-ND - USB IN-CIRCUIT PROG LPC9XX
568-1759-ND - EMULATOR DEBUGGER/PROGRMMR LPC9X
568-1758-ND - BOARD EVAL FOR LPC93X MCU FAMILY
其它名稱: 568-2251-5
935274647151
P89LPC935FHN
P89LPC935FHN-S
P89LPC933_934_935_936
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 12 January 2011
56 of 77
NXP Semiconductors
P89LPC933/934/935/936
8-bit microcontroller with accelerated two-clock 80C51 core
10. Limiting values
[1]
The following applies to Table 10:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over ambient temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
Table 10.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb(bias)
bias ambient temperature
55
+125
°C
Tstg
storage temperature
65
+150
°C
IOH(I/O)
HIGH-level output current per
input/output pin
-20
mA
IOL(I/O)
LOW-level output current per
input/output pin
-20
mA
II/Otot(max)
maximum total input/output current
-
100
mA
Vxtal
crystal voltage
on XTAL1, XTAL2 pin to VSS
-VDD + 0.5
V
Vn
voltage on any other pin
except XTAL1, XTAL2 to VSS
0.5
+5.5
V
Ptot(pack)
total power dissipation (per package)
based on package heat
transfer, not device power
consumption
-1.5
W
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