- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄367742 > P89LPC901 (NXP Semiconductors N.V.) 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM PDF資料下載
參數(shù)資料
| 型號： | P89LPC901 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| 中文描述： | 8位微控制器兩個小時80C51的核心具有1KB 3伏閃光的128字節(jié)RAM |
| 文件頁數(shù)： | 52/55頁 |
| 文件大?。?/td> | 1236K |
| 代理商： | P89LPC901 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁當前第52頁第53頁第54頁第55頁
Philips Semiconductors
P89LPC901/902/903
8-bit microcontrollers with two-clock 80C51 core
Product data
Rev. 04 — 21 November 2003
52 of 55
9397 750 12293
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
14.4 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Hot bar soldering or manual soldering is suitable for PMFP packages.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 16:
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
Package
[1]
Soldering method
Wave
Through-hole
mount
SDIP, SIL
Through-hole-
surface mount
Surface mount
BGA, LBGA, LFBGA,
SQFP, SSOP-T
[5]
,
TFBGA, VFBGA
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
[7]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO,
VSSOP
Reflow
[2]
Dipping
suitable
DBS, DIP, HDIP, RDBS,
suitable
[3]
PMFP
[4]
not suitable
νοτ
συιταβλε
suitable
not suitable
not suitable
[6]
suitable
suitable
not recommended
[7][8]
not recommended
[9]
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| P89LPC901FD | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| P89LPC901FN | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| P89LPC902 | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| P89LPC902FD | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| P89LPC902FN | 8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| P89LPC901FD | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| P89LPC901FD,112 | 功能描述:8位微控制器 -MCU 80C51 1K FL 128B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
| P89LPC901FD112 | 制造商:NXP Semiconductors 功能描述:IC 8BIT MCU 80C51 12MHZ SOIC-8 |
| P89LPC901FN | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontrollers with two-clock 80C51 core 1 kB 3 V Flash with 128-byte RAM |
| P89LPC901FN,129 | 功能描述:8位微控制器 -MCU 80C51 1K FL 128B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
發(fā)布緊急采購，3分鐘左右您將得到回復。