There are three thermal paramet" />
參數(shù)資料
型號： ORT82G5-2FN680C
廠商： Lattice Semiconductor Corporation
文件頁數(shù)： 18/119頁
文件大?。?/td> 0K
描述： IC TRANCEIVERS FPSC 680FPBGA
產(chǎn)品變化通告： Product Discontinuation 01/Aug/2011
標(biāo)準(zhǔn)包裝： 24
系列： *
Lattice Semiconductor
ORCA ORT42G5 and ORT82G5 Data Sheet
114
Package Thermal Characteristics Summary
There are three thermal parameters that are in common use: ΘJA, ψJC, and ΘJC. It should be noted that all the
parameters are affected, to varying degrees, by package design (including paddle size) and choice of materials,
the amount of copper in the test board or system board, and system airow.
ΘJA
This is the thermal resistance from junction to ambient (theta-JA, R-theta, etc.):
(1)
where TJ is the junction temperature, TA, is the ambient air temperature, and Q is the chip power.
Experimentally, ΘJA is determined when a special thermal test die is assembled into the package of interest, and
the part is mounted on the thermal test board. The diodes on the test chip are separately calibrated in an oven. The
package/board is placed either in a JEDEC natural convection box or in the wind tunnel, the latter for forced con-
vection measurements. A controlled amount of power (Q) is dissipated in the test chip’s heater resistor, the chip’s
temperature (TJ) is determined by the forward drop on the diodes, and the ambient temperature (TA) is noted. Note
that ΘJA is expressed in units of °C/W.
ψJC
This JEDEC designated parameter correlates the junction temperature to the case temperature. It is generally
used to infer the junction temperature while the device is operating in the system. It is not considered a true thermal
resistance and it is dened by:
(2)
U21
—
VDD15
—
U22
—
VDD15
—
V13
—
VDD15
—
V14
—
VDD15
—
V15
—
VDD15
—
V20
—
VDD15
—
V21
—
VDD15
—
V22
—
VDD15
—
W13
—
VDD15
—
W14
—
VDD15
—
W15
—
VDD15
—
W20
—
VDD15
—
W21
—
VDD15
—
W22
—
VDD15
—
Y16
—
VDD15
—
Y17
—
VDD15
—
Y18
—
VDD15
—
Y19
—
VDD15
—
T32
—
NC
—
W32
—
NC
—
Table 45. ORT82G5 680-Pin PBGAM (fpBGA) Pinout (Continued)
680-PBGAM VDDIO Bank VREF Group
I/O
Pin Description
Additional Function
680-PBGAM
ΘJA =
TJ – TA
Q
ψJC =
TJ – TC
Q
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ORT82G5-2FN680C1 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-2FN680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 ORCA FPSC 3.7 Gb Bp ln Xcvr 643K Gt I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-2FN680I1 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-3BM680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-3BM680C2 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:0.6 to 3.7 Gbps XAUI and FC FPSCs
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