![](http://datasheet.mmic.net.cn/180000/OR2T06A-6J144I_datasheet_11340927/OR2T06A-6J144I_107.png)
Data Sheet
June 1999
ORCA Series 2 FPGAs
Lucent Technologies Inc.
107
P4
PL9C
PL10C
PL11C
PL13C
VDD5
I/O-VDD5
P1
PL9B
PL10B
PL11B
PL13B
PL16B
I/O
N3
PL9A
PL10A
PL11A
PL13A
PL16A
I/O-A8
R2
PL10D
PL11D
PL12D
PL14D
PL17D
I/O-A9
P3
PL10C
PL11C
PL12C
PL14A
PL17A
I/O
R1
PL10B
PL11B
PL12B
PL15D
PL18D
I/O
T2
PL10A
PL11A
PL12A
PL15A
PL18A
I/O-A10
R3
PL11D
PL12D
PL13D
PL16D
PL19D
I/O
T1
PL11C
PL12C
PL13C
PL16A
PL19A
I/O
R4
PL11B
PL12B
PL13B
PL17D
PL20D
I/O
U2
PL11A
PL12A
PL13A
PL17A
PL20A
I/O-A11
T3
PL12D
PL13D
PL14D
PL18D
PL21D
I/O-A12
U1
—
PL13C
PL14C
PL18C
PL21C
I/O
U4
PL12C
PL13B
PL14B
PL18B
PL21B
I/O
V2
—
PL13A
PL14A
PL18A
PL21A
I/O
U3
PL12B
PL14D
PL15D
PL19D
PL22D
I/O
V1
PL12A
PL14C
PL15C
PL19C
PL22C
I/O
W2
PL13D
PL14B
PL15B
PL19B
PL22B
I/O-A13
W1
PL13C
PL14A
PL15A
PL19A
PL22A
I/O
V3
PL13B
PL15D
PL16D
PL20D
PL23D
I/O
Y2
PL13A
PL15C
PL16C
PL20C
PL23C
I/O
W4
PL14D
PL15B
PL16B
PL20B
PL24D
I/O
Y1
—
PL15A
PL16A
PL20A
PL25D
I/O
W3
PL14C
PL16D
PL17D
PL21D
PL25A
I/O-A14
AA2
PL14B
PL16C
PL17C
PL21C
PL26C
I/O
Y4
PL14A
PL16B
PL17B
PL21B
PL26B
I/O
AA1
—
PL16A
PL17A
PL21A
PL26A
I/O
Y3
PL15D
PL17D
PL18D
PL22D
VDD5
I/O-VDD5
AB2
PL15C
PL17C
PL18C
PL22C
PL27C
I/O
AB1
PL15B
PL17B
PL18A
PL22A
PL27A
I/O
AA3
PL15A
PL17A
PL19D
PL23D
PL28D
I/O
AC2
PL16D
PL18D
PL19C
PL28C
I/O
AB4
PL16C
PL18C
PL19A
PL23A
PL28A
I/O
AC1
PL16B
PL18B
PL20D
PL24D
PL29A
I/O
AB3
—
PL20C
PL24C
PL30C
I/O
AD2
—
PL20B
PL24B
PL30B
I/O
AC3
PL16A
PL18A
PL20A
PL24A
PL30A
I/O-A15
AD1
CCLK
PCCLK
CCLK
AF2
PB1A
I/O-A16
Pin Information (continued)
Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA
Pinout (continued)
Pin
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
2C/2T26A Pad OR2T40A/B Pad
Function
Notes:
The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series.
The pins labeled VSS-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane
of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.