![](http://datasheet.mmic.net.cn/180000/OR2T06A-6J144I_datasheet_11340927/OR2T06A-6J144I_110.png)
Data Sheet
ORCA Series 2 FPGAs
June 1999
110
Lucent Technologies Inc.
AC25
PR16B
PR18B
PR20C
PR24C
PR29A
I/O
AC24
PR16C
PR18C
PR20D
PR24D
PR29D
I/O
AC26
PR16D
PR18D
PR19A
PR23A
PR28A
I/O
AB25
PR15A
PR17A
PR19D
PR23D
PR28D
I/O
AB23
PR15B
PR17B
PR18A
PR22A
PR27A
I/O
AB24
PR15C
PR17C
PR18B
PR22B
PR27B
I/O
AB26
PR15D
PR17D
PR18D
PR22D
PR27D
I/O
AA25
PR14A
PR16A
PR17A
PR21A
PR26A
I/O
Y23
PR14B
PR16B
PR17B
PR21B
PR26B
I/O
AA24
PR14C
PR16C
PR17C
PR21C
PR26C
I/O
AA26
—
PR16D
PR17D
PR21D
PR25A
I/O
Y25
PR14D
PR15A
PR16A
PR20A
PR24A
I/O
Y26
—
PR15B
PR16B
PR20B
PR24B
I/O
Y24
PR13A
PR15C
PR16C
PR20C
PR24D
I/O
W25
PR13B
PR15D
PR16D
PR20D
PR23D
I/O-M1
V23
PR13C
PR14A
PR19A
PR22A
I/O
W26
—
PR14B
PR15B
PR19B
PR22B
I/O
W24
PR13D
PR14C
PR15C
PR19C
PR22C
I/O
V25
PR12A
PR14D
PR15D
PR19D
VDD5
I/O-VDD5
V26
PR12B
PR13A
PR14A
PR18A
PR21A
I/O
U25
—
PR13B
PR14B
PR18B
PR21B
I/O
V24
PR12C
PR13C
PR14C
PR18C
PR21C
I/O
U26
PR12D
PR13D
PR14D
PR18D
PR21D
I/O
U23
PR11A
PR12A
PR13A
PR17A
PR20A
I/O-M2
T25
PR11B
PR12B
PR13B
PR17D
PR20D
I/O
U24
PR11C
PR12C
PR13C
PR16A
PR19A
I/O
T26
PR11D
PR12D
PR13D
PR16D
PR19D
I/O
R25
PR10A
PR11A
PR12A
PR15A
PR18A
I/O-M3
R26
PR10B
PR11B
PR12B
PR15D
PR18D
I/O
T24
PR10C
PR11C
PR12C
PR14A
PR17A
I/O
P25
PR10D
PR11D
PR12D
PR14D
PR17D
I/O
R23
PR9A
PR10A
PR11A
PR13A
PR16A
I/O
P26
PR9B
PR10B
PR11B
PR13B
PR16B
I/O
R24
PR9C
PR10C
PR11C
PR13C
PR16C
I/O
N25
PR9D
PR10D
PR11D
PR13D
PR16D
I/O
N23
PR8A
PR9A
PR10A
PR12A
PR15A
I/O
N26
PR8B
PR9B
PR10B
PR12B
PR15B
I/O
P24
PR8C
PR9C
PR10C
PR12C
PR15C
I/O
M25
PR8D
PR9D
PR10D
PR12D
PR15D
I/O
Pin Information (continued)
Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA
Pinout (continued)
Pin
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
2C/2T26A Pad OR2T40A/B Pad
Function
Notes:
The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series.
The pins labeled VSS-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane
of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.