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Data Sheet
June 1999
ORCA Series 2 FPGAs
Lucent Technologies Inc.
181
Package Outline Drawings (continued)
240-Pin SQFP2
Dimensions are in millimeters.
5-3825r.8
0.50/0.75
GAGE PLANE
SEATING PLANE
1.30 REF
0.25
DETAIL A
DETAIL B
0.17/0.27
0.10 M
0.090/0.200
CHIP
CHIP BONDED FACE UP
COPPER HEAT SINK
0.08
3.40
± 0.20
SEATING PLANE
0.25 MIN
0.50 TYP
DETAIL A
DETAIL B
180
121
181
240
34.60
± 0.20
1
32.00
± 0.20
60
61
120
PIN #1 IDENTI FIER ZONE
32.00
± 0.20
34.60
± 0.20
EXPOSED HEAT SINK APPEARS ON
TOP SURFACE IN CHIP FACE-DOWN VERSION OR
BOTTOM SURFACE IN CHIP FACE-UP VERSION
24.2
REF
24. 2 REF
4.10 MAX