![](http://datasheet.mmic.net.cn/180000/OR2C06A-7J160_datasheet_11339907/OR2C06A-7J160_109.png)
Data Sheet
June 1999
ORCA Series 2 FPGAs
Lucent Technologies Inc.
109
AD13
PB9D
PB10D
PB11D
PB13D
PB16D
I/O
AE15
PB10A
PB11A
PB12A
PB14A
VDD5
I/O-VDD5
AD14
PB10B
PB11B
PB12B
PB14D
PB17D
I/O
AF15
PB10C
PB11C
PB12C
PB15A
PB18A
I/O
AE16
PB10D
PB11D
PB12D
PB15D
PB18D
I/O
AD15
PB11A
PB12A
PB13A
PB16A
PB19A
I/O-HDC
AF16
PB11B
PB12B
PB13B
PB16D
PB19D
I/O
AC15
PB11C
PB12C
PB13C
PB17A
PB20A
I/O
AE17
PB11D
PB12D
PB13D
PB17D
PB20D
I/O
AD16
PB12A
PB13A
PB14A
PB18A
PB21A
I/O-LDC
AF17
PB12B
PB13B
PB14B
PB18B
PB21D
I/O
AC17
PB12C
PB13C
PB14C
PB18C
PB22A
I/O
AE18
PB12D
PB13D
PB14D
PB18D
PB22D
I/O
AD17
PB13A
PB14A
PB15A
PB19A
PB23A
I/O
AF18
PB13B
PB14B
PB15B
PB19B
PB24A
I/O
AE19
—
PB14C
PB15C
PB19C
PB24C
I/O
AF19
PB13C
PB14D
PB15D
PB19D
PB24D
I/O
AD18
PB13D
PB15A
PB16A
PB20A
PB25A
I/O-INIT
AE20
—
PB15B
PB16B
PB20B
PB25B
I/O
AC19
PB14A
PB15C
PB16C
PB20C
PB25C
I/O
AF20
—
PB15D
PB16D
PB20D
PB25D
I/O
AD19
PB14B
PB16A
PB17A
PB21A
VDD5
I/O-VDD5
AE21
PB14C
PB16B
PB17B
PB21B
PB26B
I/O
AC20
PB14D
PB16C
PB17C
PB21C
PB26C
I/O
AF21
PB15A
PB16D
PB17D
PB21D
PB26D
I/O
AD20
PB15B
PB17A
PB18A
PB22A
PB27A
I/O
AE22
PB15C
PB17B
PB18B
PB22B
PB27B
I/O
AF22
PB15D
PB17C
PB18D
PB22D
PB27D
I/O
AD21
PB16A
PB17D
PB19A
PB23A
PB28A
I/O
AE23
—
PB19C
PB23B
PB28B
I/O
AC22
PB16B
PB18A
PB19D
PB23D
PB28D
I/O
AF23
PB16C
PB18B
PB20A
PB24A
PB29A
I/O
AD22
PB16D
PB18C
PB20B
PB24B
PB29D
I/O
AE24
—
PB20C
PB24C
PB30C
I/O
AD23
—
PB18D
PB20D
PB24D
PB30D
I/O
AF24
DONE
PDONE
DONE
AE26
RESET
PRESETN
RESET
AD25
PRGM
PPRGMN
PRGM
AD26
PR16A
PR18A
PR20A
PR24A
PR30A
I/O-M0
Pin Information (continued)
Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA
Pinout (continued)
Pin
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
2C/2T26A Pad OR2T40A/B Pad
Function
Notes:
The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series.
The pins labeled VSS-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane
of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.