![](http://datasheet.mmic.net.cn/180000/OR2C06A-7J160_datasheet_11339907/OR2C06A-7J160_112.png)
Data Sheet
ORCA Series 2 FPGAs
June 1999
112
Lucent Technologies Inc.
A23
PT15D
PT17D
PT19A
PT23A
PT28A
I/O-RDY/
RCLK
B22
PT15C
PT17C
PT18D
PT22D
PT27D
I/O
D22
PT15B
PT17B
PT18C
PT22C
PT27C
I/O
C22
PT15A
PT17A
PT18A
PT22A
PT27A
I/O
A22
PT14D
PT16D
PT17D
PT21D
PT26D
I/O
B21
PT14C
PT16C
PT17C
PT21C
PT26C
I/O
D20
PT14B
PT16B
PT17B
PT21B
PT26B
I/O
C21
PT14A
PT16A
PT17A
PT21A
PT26A
I/O
A21
PT13D
PT15D
PT16D
PT20D
PT25D
I/O-D7
B20
—
PT15C
PT16C
PT20C
PT25C
I/O
A20
PT13C
PT15B
PT16B
PT20B
PT25B
I/O
C20
—
PT15A
PT16A
PT20A
PT25A
I/O
B19
PT13B
PT14D
PT15D
PT19D
VDD5
I/O-VDD5
D18
—
PT14C
PT15C
PT19C
PT24C
I/O
A19
PT13A
PT14B
PT15B
PT19B
PT24B
I/O
C19
—
PT14A
PT15A
PT19A
PT23D
I/O
B18
PT12D
PT13D
PT14D
PT18D
PT22D
I/O
A18
PT12C
PT13C
PT14C
PT18C
PT22A
I/O
B17
PT12B
PT13B
PT14B
PT18B
PT21D
I/O-D6
C18
PT12A
PT13A
PT14A
PT18A
PT21A
I/O
A17
PT11D
PT12D
PT13D
PT17D
PT20D
I/O
D17
PT11C
PT12C
PT13C
PT17A
PT20A
I/O
B16
PT11B
PT12B
PT13B
PT16D
PT19D
I/O
C17
PT11A
PT12A
PT13A
PT16A
PT19A
I/O-D5
A16
PT10D
PT11D
PT12D
PT15D
PT18D
I/O
B15
PT10C
PT11C
PT12C
PT15A
PT18A
I/O
A15
PT10B
PT11B
PT12B
PT14D
PT17D
I/O
C16
PT10A
PT11A
PT12A
PT14A
PT17A
I/O-D4
B14
PT9D
PT10D
PT11D
PT13D
PT16D
I/O
D15
PT9C
PT10C
PT11C
PT13C
PT16C
I/O
A14
PT9B
PT10B
PT11B
PT13B
PT16B
I/O
C15
PT9A
PT10A
PT11A
PT13A
PT16A
I/O-D3
B13
PT8D
PT9D
PT10D
PT12D
PT15D
I/O
D13
PT8C
PT9C
PT10C
PT12C
PT15C
I/O
A13
PT8B
PT9B
PT10B
PT12B
VDD5
I/O-VDD5
C14
PT8A
PT9A
PT10A
PT12A
PT15A
I/O-D2
B12
PT7D
PT8D
PT9D
PT11D
PT14D
I/O-D1
C13
PT7C
PT8C
PT9C
PT11A
PT14A
I/O
Pin Information (continued)
Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA
Pinout (continued)
Pin
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
2C/2T26A Pad OR2T40A/B Pad
Function
Notes:
The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series.
The pins labeled VSS-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane
of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.