![](http://datasheet.mmic.net.cn/180000/OR2C06A-7J160_datasheet_11339907/OR2C06A-7J160_93.png)
Data Sheet
June 1999
ORCA Series 2 FPGAs
Lucent Technologies Inc.
93
P3
PL10D
PL11D
PL12D
PL13D
PL14D
I/O-A12
R2
PL10C
PL11C
PL12C
PL13B
PL14B
I/O
T1
PL10B
PL11B
PL12B
PL14D
PL15D
I/O
P4
PL10A
PL11A
PL13D
PL14B
PL15B
I/O-A13
R3
PL11D
PL12D
PL13B
PL14A
PL15A
I/O
T2
PL11C
PL12C
PL13A
PL15D
PL16D
I/O
U1
PL11B
PL12B
PL14D
PL15B
PL16B
I/O
T3
PL11A
PL12A
PL14C
PL16D
PL17D
I/O-A14
U2
—
PL13D
PL15D
PL17D
PL18D
I/O-VDD5
V1
PL12D
PL13C
PL15C
PL17C
PL18C
I/O
T4
PL12C
PL13B
PL15B
PL17B
PL18A
I/O
U3
PL12B
PL13A
PL15A
PL17A
PL19D
I/O
V2
—
PL14D
PL16D
PL18D
PL19C
I/O
W1
—
PL14C
PL16C
PL18C
PL19A
I/O
V3
—
PL14B
PL16B
PL18B
PL20D
I/O
W2
PL12A
PL14A
PL16A
PL18A
PL20A
I/O-A15
Y1
CCLK
Y2
PB1A
I/O-A16
W4
—
PB1C
PB1D
I/O
V4
PB1B
PB1D
PB2A
I/O
U5
PB1C
PB2A
PB2D
I/O-VDD5
Y3
PB1D
PB2B
PB3A
I/O
Y4
—
PB2C
PB3C
I/O
V5
—
PB2D
PB3D
I/O
W5
PB2A
PB3A
PB3B
PB3D
PB4D
I/O-A17
Y5
PB2B
PB3B
PB4B
PB4D
PB5D
I/O
V6
PB2C
PB3C
PB4C
PB5A
PB6A
I/O
U7
PB2D
PB3D
PB4D
PB5B
PB6B
I/O
W6
PB3A
PB4A
PB5A
PB5D
PB6D
I/O
Y6
PB3B
PB4B
PB5B
PB6A
PB7A
I/O
V7
PB3C
PB4C
PB5C
PB6B
PB7B
I/O
W7
PB3D
PB4D
PB5D
PB6D
PB7D
I/O
Y7
PB4A
PB5A
PB6A
PB7A
PB8A
I/O
V8
PB4B
PB5B
PB6B
PB7B
PB8B
I/O
W8
PB4C
PB5C
PB6C
PB7C
PB8C
I/O
Y8
PB4D
PB5D
PB6D
PB7D
PB8D
I/O
U9
PB5A
PB6A
PB7A
PB8A
PB9A
I/O
V9
PB5B
PB6B
PB7B
PB8B
PB9B
I/O
W9
PB5C
PB6C
PB7C
PB8C
PB9C
I/O
Y9
PB5D
PB6D
PB7D
PB8D
PB9D
I/O
Pin Information (continued)
Table 25. OR2C/2T06A, OR2C/2T08A, OR2C/2T10A, OR2C/2T12A, and OR2C/2T15A/B
256-Pin PBGA Pinout (continued)
Pin
2C/2T06A Pad
2C/2T08A Pad
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
Function
Notes:
The W3 pin on the 256-pin PBGA package is unconnected for all devices listed in this table.
The OR2C/2T08A do not have bond pads connected to the 256-pin PBGA package pins F2 and Y17.
The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series.
The pins labeled VSS-ETC are the 4 x 4 array of thermal balls located at the center of the package. The balls can be attached to the ground
plane of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.