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Data Sheet
ORCA Series 2 FPGAs
June 1999
96
Lucent Technologies Inc.
E19
PR2B
PR3B
PR4B
PR5B
I/O
D20
PR2C
PR3C
PR4D
PR5D
I/O
E18
PR2D
PR3D
PR3A
PR4A
I/O-VDD5
D19
PR1A
PR2A
PR3A
I/O-WR
C20
PR1B
PR2B
PR3B
I/O
E17
PR1C
PR2C
PR2A
I/O
D18
PR1D
PR2D
I/O
C19
—
PR1A
I/O
B20
—
PR1B
I/O
C18
—
PR1C
I/O
B19
—
PR1D
I/O
A20
RD_CFGN
A19
—
PT14D
PT16D
PT18D
PT20D
I/O
B18
PT12D
PT14C
PT16C
PT18C
PT20C
I/O
B17
PT12C
PT14B
PT16B
PT18B
PT20A
I/O
C17
PT12B
PT14A
PT16A
PT18A
PT19D
I/O
D16
PT12A
PT13D
PT15D
PT17D
PT19A
I/O-RDY/RCLK
A18
—
PT13C
PT15C
PT17A
PT18A
I/O
A17
PT11D
PT13B
PT15B
PT16D
PT17D
I/O
C16
PT11C
PT13A
PT15A
PT16C
PT17C
I/O
B16
PT11B
PT12D
PT14D
PT16A
PT17A
I/O
A16
PT11A
PT12C
PT13D
PT15D
PT16D
I/O-D7
C15
—
PT12B
PT13C
PT15A
PT16A
I/O
D14
PT10D
PT12A
PT13B
PT14D
PT15D
I/O-VDD5
B15
PT10C
PT11D
PT13A
PT14A
PT15A
I/O
A15
PT10B
PT11C
PT12D
PT13D
PT14D
I/O
C14
PT10A
PT11B
PT12B
PT13B
PT14B
I/O-D6
B14
PT9D
PT11A
PT12A
PT13A
PT14A
I/O
A14
PT9C
PT10D
PT11D
PT12D
PT13D
I/O
C13
—
PT10C
PT11C
PT12C
PT13C
I/O
B13
PT9B
PT10B
PT11B
PT12B
PT13B
I/O
A13
PT9A
PT10A
PT11A
PT12A
PT13A
I/O-D5
D12
PT8D
PT9D
PT10D
PT11D
PT12D
I/O
C12
PT8C
PT9C
PT10C
PT11C
PT12C
I/O
B12
PT8B
PT9B
PT10B
PT11B
PT12B
I/O
A12
PT8A
PT9A
PT10A
PT11A
PT12A
I/O-D4
B11
PT7D
PT8D
PT9D
PT10D
PT11D
I/O
C11
PT7C
PT8C
PT9C
PT10C
PT11C
I/O
A11
PT7B
PT8B
PT9B
PT10B
PT11B
I/O
A10
PT7A
PT8A
PT9A
PT10A
PT11A
I/O-D3
Pin Information (continued)
Table 25. OR2C/2T06A, OR2C/2T08A, OR2C/2T10A, OR2C/2T12A, and OR2C/2T15A/B
256-Pin PBGA Pinout (continued)
Pin
2C/2T06A Pad
2C/2T08A Pad
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
Function
Notes:
The W3 pin on the 256-pin PBGA package is unconnected for all devices listed in this table.
The OR2C/2T08A do not have bond pads connected to the 256-pin PBGA package pins F2 and Y17.
The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series.
The pins labeled VSS-ETC are the 4 x 4 array of thermal balls located at the center of the package. The balls can be attached to the ground
plane of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.