
2
Insulation Related Specifications
Value
Parameter
Symbol
L(101)
DIP
7.1
SO8
4.9
Units
mm
Conditions
Minimum External Air
Gap (External Clearance)
Minimum External Track-
ing (External Creepage)
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along
body.
Through insulation distance, conductor to
conductor, usually the direct distance
between (Internal Clearance) the photo-
emitter and photodetector inside the
optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
L(102)
7.4
4.8
mm
Minimum Internal
Plastic Gap
0.08
0.08
mm
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
CTI
175
175
V
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89,
Table 1)
Figure 1. Thermal Derating Curve, Dependence of Safety Limiting Value with
Case Temperature per VDE 0884.
O
S
,
S
0
0
T
A
– CASE TEMPERATURE – °C
200
50
400
125
25
75
100
150
600
800
200
(150)
100
300
500
700
175
P
S
(mW)
I
S
(mA)
SURFACE MOUNT SO8 PRODUCT
O
S
,
S
0
0
T
A
– CASE TEMPERATURE – °C
200
50
400
125
25
75
100
150
600
800
200
100
300
(230)
500
700
175
P
S
(mW)
I
S
(mA)
STANDARD 8 PIN DIP PRODUCT
All Agilent data sheets report the
creepage and clearance inherent
to the optocoupler component
itself. These dimensions are
needed as a starting point for the
equipment designer when
determining the circuit insulation
requirements. However, once
mounted on a printed circuit
board, minimum creepage and
clearance requirements must be
met as specified for individual
equipment standards. For
creepage, the shortest distance
path along the surface of a
printed circuit board between the
solder fillets of the input and
output leads must be considered.
There are recommended
techniques such as grooves and
ribs which may be used on a
printed circuit board to achieve
desired creepage and clearances.
Creepage and clearance distances
will also change depending on
factors such as pollution degree
and insulation level.