
OPA640
3
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ABSOLUTE MAXIMUM RATINGS
Power Supply ..............................................................................
±
5.5VDC
Internal Power Dissipation ..................................Thermal Considerations
Differential Input Voltage ..................................................................
±
1.2V
Input Voltage Range............................................................................
±
V
S
Storage Temperature Range: P, U, UB ........................ –40
°
C to +125
°
C
Lead Temperature (soldering, 10s).............................................. +300
°
C
(soldering, SO-8 3s) ....................................... +260
°
C
Junction Temperature (T
J
)............................................................ +175
°
C
PIN CONFIGURATION
NOTE: (1) Making use of all four power supply pins is highly recommended,
although not required. Using these four pins, instead of just pins 4 and 7, will
lower the effective pin impedance and substantially lower distortion.
Top View
DIP/SO-8
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per-
formance degradation to complete device failure. Burr-
Brown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
PACKAGE DRAWING
NUMBER
(1)
PRODUCT
PACKAGE
OPA640P
OPA640U, UB
8-Pin Plastic DIP
SO-8 Surface Mount
006
182
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book. (2) The “B” grade of the
SO-8 and package will be marked with a “B” by pin 8.
PACKAGE/ORDERING INFORMATION
1
2
3
4
8
7
6
5
+V
S2(1)
+V
S1
Output
–V
S2(1)
NC
Inverting Input
Non-Inverting Input
–V
S1