
3
OPA627, 637
PIN CONFIGURATIONS
DIP/SOIC
Top View
Offset Trim
–In
+In
–V
No Internal Connection
+V
Output
Offset Trim
S
S
1
2
3
4
8
7
6
5
Top View
TO-99
Offset Trim
–In
Output
Offset Trim
+In
–V
S
+V
S
No Internal Connection
Case connected to –V
S
.
8
1
2
3
4
5
6
7
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage ..................................................................................
±
18V
Input Voltage Range.............................................. +V
+ 2V to –V
S
– 2V
Differential Input Range.......................................................Total V
+ 4V
Power Dissipation ........................................................................1000mW
Operating Temperature
M Package.................................................................. –55
°
C to +125
°
C
P, U Package ............................................................. –40
°
C to +125
°
C
Storage Temperature
M Package.................................................................. –65
°
C to +150
°
C
P, U Package ............................................................. –40
°
C to +125
°
C
Junction Temperature
M Package.................................................................................. +175
°
C
P, U Package ............................................................................. +150
°
C
Lead Temperature (soldering, 10s)............................................... +300
°
C
SOlC (soldering, 3s) ................................................................... +260
°
C
NOTE: (1) Stresses above these ratings may cause permanent damage.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE DRAWING
NUMBER
(1)
TEMPERATURE
RANGE
PRODUCT
PACKAGE
OPA627AP
OPA627BP
OPA627AU
OPA627AM
OPA627BM
OPA627SM
Plastic DIP
Plastic DIP
SOIC
TO-99 Metal
TO-99 Metal
TO-99 Metal
006
006
182
001
001
001
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–55
°
C to +125
°
C
OPA637AP
OPA637BP
OPA637AU
OPA637AM
OPA637BM
OPA637SM
Plastic DIP
Plastic DIP
SOIC
TO-99 Metal
TO-99 Metal
TO-99 Metal
006
006
182
001
001
001
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–25
°
C to +85
°
C
–55
°
C to +125
°
C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.