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參數(shù)資料
| 型號： | OPA552 |
| 英文描述： | High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
| 中文描述： | 高電壓，大電流運算放大器 |
| 文件頁數(shù)： | 11/14頁 |
| 文件大?。?/td> | 202K |
| 代理商： | OPA552 |
11
OPA551, OPA552
power supplies, this creates an internal dissipation of 11.4W.
This far exceeds the maximum rating and is not recom-
mended. If operation in this region is unavoidable, use the
DDPAK with a heat sink.
HEAT SINKING
Power dissipated in the OPA551 or OPA552 will cause the
junction temperature to rise. For reliable operation, the
junction temperature should be limited to +125
°
C. Many
applications will require a heat sink to assure that the
maximum operating junction temperature is not exceeded.
The heat sink required depends on the power dissipated and
on ambient conditions.
For heat sinking purposes, the tab of the DDPAK is typically
soldered directly to a circuit board copper area. Increasing
the copper area improves heat dissipation. Figure 6 shows
typical thermal resistance from junction-to-ambient as a
function of copper area.
Depending on conditions, additional heat sinking may be
required. Aavid Thermal Products Inc. manufactures sur-
face-mountable heat sinks designed specifically for use with
DDPAK packages. Further information is available on
Aavid’s web site, www.aavid.com.
To estimate the margin of safety in a complete design
(including heat sink), increase the ambient temperature until
the thermal protection is activated. Use worst-case load and
signal conditions. For good reliability, the thermal protec-
tion should trigger more than +25
°
C above the maximum
expected ambient condition of your application. This pro-
duces a junction temperature of +125
°
C at the maximum
expected ambient condition.
FIGURE 5. DDPAK-7 Safe Operating Area.
FIGURE 3. DIP-8 Safe Operating Area.
FIGURE 4. SO-8 Safe Operating Area.
FIGURE 6. DDPAK Thermal Resistance vs Circuit Board
Copper Area.
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
50
40
30
20
10
0
0
1
2
3
4
5
Copper Area (inches
2
)
OPA551, OPA552
Surface-Mount Package
1oz. copper
Circuit Board Copper Area
OPA551, OPA552
Surface-Mount Package
T
J
°
C
θ
1000
100
10
1
0.1
1
10
100
| V
S
| – | V
O
| (V)
I
O
SAFE OPERATING AREA—8-PIN DIP
125
°
C
85
°
C
25
°
C
1000
100
10
1
0.1
1
10
100
| V
S
| – | V
O
| (V)
I
O
SAFE OPERATING AREA—SO-8
125
°
C
85
°
C
25
°
C
1000
100
10
1
0.1
1
10
100
| V
S
| – | V
O
| (V)
I
O
SAFE OPERATING AREA—DDPAK
125
°
C
125
°
C
1" Copper
85
°
C
25
°
C
25
°
C
1" Copper
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| OPA552FA | High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
| OPA552PA | High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
| OPA552UA | High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
| OPA551FA | High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
| OPA551PA | High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OPA552FA | 制造商:Texas Instruments 功能描述:OP-AMP, 5000 uV OFFSET-MAX, 12 MHz BAND WIDTH, PSSO7 |
| OPA552FA/500 | 功能描述:運算放大器 - 運放 High-Volt High-Crnt Oper Amplifier RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA552FA/500G3 | 功能描述:運算放大器 - 運放 High-Volt High-Crnt Oper Amplifier RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA552FA500 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
| OPA552FA500G3 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:High-Voltage, High-Current OPERATIONAL AMPLIFIERS |
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