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參數(shù)資料
| 型號： | OPA544TG3 |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 5/11頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP PWR 1.4MHZ SGL TO220-5 |
| 標(biāo)準(zhǔn)包裝： | 49 |
| 放大器類型： | 功率 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 8 V/µs |
| 增益帶寬積： | 1.4MHz |
| 電流 - 輸入偏壓： | 15pA |
| 電壓 - 輸入偏移： | 1000µV |
| 電流 - 電源： | 12mA |
| 電流 - 輸出 / 通道： | 4A |
| 電壓 - 電源，單路/雙路(±)： | 20 V ~ 70 V，±10 V ~ 35 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | TO-220-5 |
| 供應(yīng)商設(shè)備封裝： | TO-220-5 |
| 包裝： | 管件 |
3
OPA544
Top View
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V– ................................................................... 70V
Output Current ................................................................. See SOA Curve
Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V
Operating Temperature ................................................. –40
°C to +125°C
Storage Temperature ..................................................... –40
°C to +125°C
Junction Temperature ...................................................................... 150
°C
Lead Temperature (soldering –10s)(1) ............................................................... 300
°C
CONNECTION DIAGRAMS
NOTE: (1) Vapor-phase or IR reflow techniques are recommended for solder-
ing the OPA544F surface mount package. Wave soldering is not recommended
due to excessive thermal shock and “shadowing” of nearby devices.
V–
V
O
V+
V
IN
V
IN
123 4 5
+
–
Tab is connected
to V– supply.
5-Lead
Surface Mount
V–
V
O
V+
V
IN
V
IN
123 4 5
5-Lead TO-220
and
Stagger-Formed
TO-220
+
–
Tab is connected
to V– supply.
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE DRAWING
PRODUCT
PACKAGE
NUMBER(1)
OPA544T
5-Lead TO-220
315
OPA544T-1 5-Lead Stagger-Formed TO-220
323
OPA544F
5-Lead Surface-Mount
325
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