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參數(shù)資料
| 型號： | OPA4727 |
| 英文描述： | 20MHz, High Precision CMOS Operational Amplifier |
| 中文描述： | 為20MHz，高精度CMOS運(yùn)算放大器 |
| 文件頁數(shù)： | 14/20頁 |
| 文件大小： | 537K |
| 代理商： | OPA4727 |
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SBOS314B SEPTEMBER 2004 REVISED DECEMBER 2004
www.ti.com
14
NOTE: FilterPro is a low-pass filter design program available for download at no cost from TI’s web site (www.ti.com). The program can be used
to determine component values for other cutoff frequencies or filter types.
DC Gain = 1
Cutoff Frequency = 50kHz
1/2
OPA2727
C
1
1nF
C
330pF
R
2
15.9k
R
1
1.93k
2.2nF
C
C
100pF
R
4
22.3k
R
3
2.07k
1/2
OPA2727
V
O
Figure 7. Four-Pole Butterworth Sallen-Key Low-Pass Filter
DFN PACKAGE
The OPA727 series uses the 8-lead DFN (also known as
SON), which is a QFN package with lead contacts on only
two sides of the bottom of the package. This leadless,
near-chip-scale package maximizes board space and
enhances thermal and electrical characteristics through
an exposed pad.
DFN packages are physically small, have a smaller routing
area, improved thermal performance, and improved
electrical parasitics, with a pinout scheme that is
consistent with other commonly-used packages, such as
SO and MSOP. Additionally, the absence of external leads
eliminates bent-lead issues.
The DFN package can be easily mounted using standard
printed circuit board (PCB) assembly techniques. See
Application Note,
QFN/SON PCB Attachment
(SLUA271)
and Application Report,
Quad Flatpack No-Lead Logic
Packages
(SCBA017), both available for download at
www.ti.com.
The exposed leadframe die pad on the bottom of the
package should be connected to V.
LAYOUT GUIDELINES
The leadframe die pad should be soldered to a thermal pad
on the PCB. A mechanical data sheet showing an example
layout is attached at the end of this data sheet.
Refinements to this layout may be required based on
assembly process requirements. Mechanical drawings
located at the end of this data sheet list the physical
dimensions for the package and pad. The five holes in the
landing pattern are optional, and are intended for use with
thermal vias that connect the leadframe die pad to the
heatsink area on the PCB.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests. Even
with applications that have low-power dissipation, the
exposed pad must be soldered to the PCB to provide
structural integrity and long-term reliability.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OPA4727AIPW | 功能描述:運(yùn)算放大器 - 運(yùn)放 20MHz High Prec CMOS Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA4727AIPWG4 | 功能描述:運(yùn)算放大器 - 運(yùn)放 20MHz High Prec CMOS Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA4727AIPWR | 功能描述:運(yùn)算放大器 - 運(yùn)放 etrim 20MHz Hi Precisin CMOS Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA4727AIPWRG4 | 功能描述:運(yùn)算放大器 - 運(yùn)放 e-trim(TM) 20MHz Hi Prec CMOS Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| OPA4743 | 制造商:BB 制造商全稱:BB 功能描述:12V, 7MHz, CMOS, Rail-to-Rail I/O OPERATIONAL AMPLIFIERS |
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