Boldface lim" />
參數(shù)資料
型號: OPA170AIDR
廠商: Texas Instruments
文件頁數(shù): 29/34頁
文件大小: 0K
描述: IC OPAMP GP RR 1.2MHZ 8SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.4 V/µs
增益帶寬積: 1.2MHz
電流 - 輸入偏壓: 8pA
電壓 - 輸入偏移: 250µV
電流 - 電源: 110µA
電流 - 輸出 / 通道: 20mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 36 V,±1.35 V ~ 18 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 帶卷 (TR)
SBOS557B – AUGUST 2011 – REVISED SEPTEMBER 2012
ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, VCM = VOUT = VS/2, and RL = 10kΩ connected to VS/2, unless otherwise noted.
OPA170, OPA2170, OPA4170
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE
Specified range
–40
+125
°C
Operating range
–55
+150
°C
THERMAL INFORMATION: OPA170
OPA170
THERMAL METRIC(1)
D (SO)
DBV (SOT23)
DRL (SOT553)
UNITS
8 PINS
5 PINS
θJA
Junction-to-ambient thermal resistance
149.5
245.8
208.1
θJC(top)
Junction-to-case(top) thermal resistance
97.9
133.9
0.1
θJB
Junction-to-board thermal resistance
87.7
83.6
42.4
°C/W
ψJT
Junction-to-top characterization parameter
35.5
18.2
0.5
ψJB
Junction-to-board characterization parameter
89.5
83.1
42.2
θJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2170
OPA2170
THERMAL METRIC(1)
D (SO)
DCU (VSSOP)
DGK (MSOP)
UNITS
8 PINS
θJA
Junction-to-ambient thermal resistance
134.3
175.2
180
θJC(top)
Junction-to-case(top) thermal resistance
72.1
74.9
55
θJB
Junction-to-board thermal resistance
60.6
22.2
130
°C/W
ψJT
Junction-to-top characterization parameter
18.2
1.6
5.3
ψJB
Junction-to-board characterization parameter
53.8
22.8
120
θJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4170
OPA4170
THERMAL METRIC(1)
D (SO)
PW (TSSOP)
UNITS
14 PINS
θJA
Junction-to-ambient thermal resistance
93.2
106.9
θJC(top)
Junction-to-case(top) thermal resistance
51.8
24.4
θJB
Junction-to-board thermal resistance
49.4
59.3
°C/W
ψJT
Junction-to-top characterization parameter
13.5
0.6
ψJB
Junction-to-board characterization parameter
42.2
54.3
θJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright 2011–2012, Texas Instruments Incorporated
Product Folder Links: OPA170 OPA2170 OPA4170
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