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SBOS286A DECEMBER 2003 REVISED SEPTEMBER 2006
www.ti.com
2
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DRAWING
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
SO-8
D
40
°
C to +85
°
C
OPA1632
OPA1632D
Rails, 100
OPA1632
OPA1632DR
Tape and Reel, 2500
MSOP-8
PowerPAD
DGN
40
°
C to +85
°
C
1632
OPA1632DGN
Rails, 100
OPA1632DGNR
Tape and Reel, 2500
(1)For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
over operating free-air temperature range unless otherwise noted.
Supply Voltage,
±
VS
Input Voltage, VI
Output Current, IO
Differential Input Voltage, VID
Maximum Junction Temperature, TJ
Operating Free-Air Temperature Range
Storage Temperature Range, TSTG
ESD Ratings: Human Body Model
Charge Device Model
Machine Model
±
16.5V
±
VS
150mA
±
3V
150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
40
°
C to +85
°
C
65
°
C to +150
°
C
1kV
500V
200V
(1)Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2)The OPA1632 MSOP-8 package version incorporates a
PowerPAD on the underside of the chip. This acts as a heatsink
and must be connected to a thermally dissipative plane for proper
power dissipation. Failure to do so may result in exceeding the
maximum junction temperature, which can permanently damage
the device. See TI technical brief SLMA002 for more information
about using the PowerPAD thermally enhanced package.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PIN CONFIGURATION
Top View
MSOP, SO
1
2
3
4
8
7
6
5
V
IN+
Enable
V
V
OUT
V
IN
V
OCM
V+
V
OUT+
OPA1632