參數(shù)資料
型號: OP497GSZ-REEL
廠商: Analog Devices Inc
文件頁數(shù): 9/16頁
文件大?。?/td> 0K
描述: IC OPAMP GP 500KHZ QUAD 16SOIC
標準包裝: 1,000
放大器類型: 通用
電路數(shù): 4
轉(zhuǎn)換速率: 0.15 V/µs
增益帶寬積: 500kHz
電流 - 輸入偏壓: 60pA
電壓 - 輸入偏移: 80µV
電流 - 電源: 525µA
電流 - 輸出 / 通道: 25mA
電壓 - 電源,單路/雙路(±): ±2 V ~ 20 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC W
包裝: 帶卷 (TR)
OP497
Rev. E | Page 2 of 16
TABLE OF CONTENTS
REVISION HISTORY
2/09—Rev. D to Rev. E
Deleted 14-Lead CERDIP............................................. Throughout
Changes to Features Section and General Description
Section................................................................................................ 1
Delete Military Processed Devices Text, SMD Part Number,
ADI Part Number Table, and Dice Characteristics Figure ......... 3
Changes to Table 1............................................................................ 3
Changes to Absolute Maximum Ratings Section......................... 4
Changes to Figure 12........................................................................ 6
Changes to Figure 18 and Figure 19............................................... 7
Changes to Figure 26 and Figure 28............................................... 8
Deleted OP497 Spice Macro-Model Section............................... 10
Changes to Applications Information Section............................ 10
Moved Figure 33 ............................................................................. 10
Deleted Table I. OP497 SPICE Net-List....................................... 11
Changes to Open-Loop Gain Linearity Section and
Figure 35 .......................................................................................... 11
Changes to Figure 40...................................................................... 13
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 15
11/01—Rev. C to Rev. D
Edits to Pin Connection Headings..................................................1
Deleted Wafer Test Limits ................................................................3
Edits to Absolute Maximum Ratings ..............................................5
Edits to Outline Dimensions......................................................... 16
Edits to Ordering Guide ................................................................ 17
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