參數(shù)資料
型號(hào): NUF2441FC
廠商: ON SEMICONDUCTOR
英文描述: Integrated Passive Filter with ESD Protection
中文描述: 集成無源濾波器與ESD保護(hù)
文件頁(yè)數(shù): 1/4頁(yè)
文件大?。?/td> 57K
代理商: NUF2441FC
Semiconductor Components Industries, LLC, 2005
May, 2005 Rev. 4
1
Publication Order Number:
NUF2441FC/D
NUF2441FC
Integrated Passive Filter
with ESD Protection
This device is designed for cell phone applications requiring
Headset and Speaker Phone
,
EMI Filtering
and
ESD Protection
.
This device offers an integrated solution in a small package reducing
PCB space and cost.
Features:
Provides EMI Filtering and ESD Protection
Single IC Offers Cost Savings by Replacing 2 Inductors,
4 Capacitors, and 4 TVs Diodes
Compliance with IEC6100042, (Level 4)
30 kV (Contact), 30 kV (air)
FlipChip Package
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
ESD Ratings:
Human Body Model = 3B
This is a PbFree Device*
Benefits:
FlipChip Package Minimizes PCB Space
Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
Cell Phones
Communication Circuits
MAXIMUM RATINGS
(T
A
= 25
°
C)
Rating
Symbol
Value
Unit
ESD Discharge IEC6100042
Contact Discharge
Air Discharge
V
pp
30
30
kV
Operating Temperature Range
T
J
40 to +125
°
C
Storage Temperature Range
T
stg
55 to +150
°
C
Lead Solder Temperature
(10 second duration)
T
L
260
°
C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device
Package
Shipping
ORDERING INFORMATION
NUF2441FCT1G
FlipChip
(PbFree)
3000/Tape & Reel
CIRCUIT DESCRIPTION
C
1
C
1
L
L
C
2
C
2
B3
A3
B1
A1
B2
A2
MARKING
DIAGRAM
PIN CONFIGURATION
FlipChip
CASE 499J
2441AYWW
è
A3
A1
B1
A2
B3
B2
(Bump View)
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
A1
http://onsemi.com
2441
A
Y
WW
= Specific Device Code
= Assembly Location
= Year
= Work Week
NUF2441FCT1
FlipChip
3000/Tape & Reel
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