參數(shù)資料
型號(hào): NSPE510S
廠商: Electronic Theatre Controls, Inc.
英文描述: SPECIFICATIONS FOR NICHIA BLUISH GREEN LED
中文描述: 藍(lán)綠色的日亞的LED規(guī)格
文件頁(yè)數(shù): 6/15頁(yè)
文件大?。?/td> 394K
代理商: NSPE510S
-5-
Nichia STSE-CE2173A
<Cat.No.020830>
(4) Soldering Conditions
· Nichia BG-LED leadframes are comprised of a silver plated copper alloy. This substance has a low
thermal coefficient (easily conducts heat). Careful attention should be paid during soldering.
· Solder the BG-LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base
of the tie bar is recommended.
· Recommended soldering conditions
Dip Soldering
Pre-Heat
Pre-Heat Time
Solder Bath
Temperature
Dipping Time
Dipping Position
base of the epoxy bulb.
· Do not apply any stress to the lead particularly when heated.
· The BG-LEDs must not be repositioned after soldering.
· After soldering the BG-LEDs, the epoxy bulb should be protected from mechanical shock or vibration
until the BG-LEDs return to room temperature.
· Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused
from warping of the PC board or from the clinching and cutting of the leadframes. When it is
absolutely necessary, the BG-LEDs may be mounted in this fashion but the User will assume
responsibility for any problems. Direct soldering should only be done after testing has confirmed that
no damage, such as wire bond failure or resin deterioration, will occur. Nichia’s BG-LEDs should not
be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin.
· When it is necessary to clamp the BG-LEDs to prevent soldering failure, it is important to minimize
the mechanical stress on the BG-LEDs.
· Cut the BG-LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause failure of the BG-LEDs.
(5) Heat Generation
· Thermal design of the end product is of paramount importance. Please consider the heat generation
of the BG-LED when making the system design. The coefficient of temperature increase per input
electric power is affected by the thermal resistance of the circuit board and density of BG-LED
placement on the board, as well as other components. It is necessary to avoid intense heat generation
and operate within the maximum ratings given in this specification.
· The operating current should be decided after considering the ambient maximum temperature of BG-LEDs.
(6) Cleaning
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the BG-LEDs. When using
other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the
resin or not. Freon solvents should not be used to clean the BG-LEDs because of worldwide regulations.
· Do not clean the BG-LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
cleaning on the BG-LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the BG-LEDs will occur.
Soldering
300°C Max.
3 seconds Max.
No closer than 3 mm from the
base of the epoxy bulb.
100°C Max.
60 seconds Max.
260°C Max.
10 seconds Max.
No lower than 3 mm from the
Temperature
Soldering Time
Position
相關(guān)PDF資料
PDF描述
NSPE590S NICHIA BLUISH GREEN LED
NSPG310A SPECIFICATIONS FOR NICHIA GREEN LED
NSPG320BS NICHIA GREEN LED
NSPG346BS LED
NSPG346BS-2098B LED
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
NSPE520S 制造商:NICHIA 制造商全稱:NICHIA CORPORATION 功能描述:BLUISH-GREEN LED
NSPE561M10V10X10.8TR13F 制造商:NIC 制造商全稱:NIC-Components Corp. 功能描述:Hybrid Surface Mount Aluminum Electrolytic Capacitors
NSPE561M10V6.3X6.3TR13F 制造商:NIC 制造商全稱:NIC-Components Corp. 功能描述:Hybrid Surface Mount Aluminum Electrolytic Capacitors
NSPE561M10V8X10.8TR13F 制造商:NIC 制造商全稱:NIC-Components Corp. 功能描述:Hybrid Surface Mount Aluminum Electrolytic Capacitors
NSPE561M4V10X10.8TR13F 制造商:NIC 制造商全稱:NIC-Components Corp. 功能描述:Hybrid Surface Mount Aluminum Electrolytic Capacitors