參數(shù)資料
型號: NLX1G11BMX1TCG
廠商: ON Semiconductor
文件頁數(shù): 11/11頁
文件大?。?/td> 0K
描述: IC GATE AND 3INPUT 6ULLGA
標準包裝: 3,000
邏輯類型: 與門
電路數(shù): 1
輸入數(shù): 3
電源電壓: 1.65 V ~ 5.5 V
電流 - 靜態(tài)(最大值): 1µA
輸出電流高,低: 32mA,32mA
額定電壓和最大 CL 時的最大傳播延遲: 7ns @ 4.5V ~ 5.5V,50pF
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
供應商設(shè)備封裝: 6-ULLGA(1.2x1)
封裝/外殼: 6-XFLGA
包裝: 帶卷 (TR)
NLX1G11
http://onsemi.com
9
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10
B
0.05
A
C
L
5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
3
4
6
DIM MIN
MAX
MILLIMETERS
A
0.40
A1
0.00
0.05
b
0.12
0.22
D
1.00 BSC
E
1.00 BSC
e
0.35 BSC
L
0.25
0.35
L1
0.30
0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.22
5X
0.48
6X
1.18
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.35
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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