參數(shù)資料
型號: NLU3G17AMX1TCG
廠商: ON Semiconductor
文件頁數(shù): 3/11頁
文件大小: 0K
描述: IC BUFF SCHMT TRG TRIPLE 8ULLGA
標準包裝: 3,000
邏輯類型: 施密特觸發(fā)器 - 緩沖器,驅(qū)動器
元件數(shù): 3
每個元件的位元數(shù): 1
輸出電流高,低: 8mA,8mA
電源電壓: 1.65 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-XFLGA
供應商設(shè)備封裝: 8-ULLGA(1.95x1)
包裝: 帶卷 (TR)
NLU3G17
http://onsemi.com
11
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P
CASE 613AC
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10
B
0.05
A
C
L
7X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
8X
A
A1
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
4
5
8
DIM MIN
MAX
MILLIMETERS
A
0.40
A1
0.00
0.05
b
0.15
0.25
D
1.95 BSC
E
1.00 BSC
e
0.50 BSC
L
0.25
0.35
L1
0.30
0.40
e/2
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
7X
0.49
8X
1.24
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NLU3G17/D
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