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參數(shù)資料
| 型號： | NLU2G17CMX1TCG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 2/10頁 |
| 文件大小： | 0K |
| 描述： | IC BUFF SCHM TRG DL N-INV 6ULLGA |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 邏輯類型： | 施密特觸發(fā)器 - 緩沖器，驅(qū)動器 |
| 元件數(shù)： | 2 |
| 每個元件的位元數(shù)： | 1 |
| 輸出電流高，低： | 8mA，8mA |
| 電源電壓： | 1.65 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-XFLGA |
| 供應(yīng)商設(shè)備封裝： | 6-ULLGA（1x1） |
| 包裝： | 帶卷 (TR) |
NLU2G17
http://onsemi.com
10
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10
B
0.05
A
C
L
5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
3
4
6
DIM MIN
MAX
MILLIMETERS
A
0.40
A1
0.00
0.05
b
0.15
0.25
D
1.45 BSC
E
1.00 BSC
e
0.50 BSC
L
0.25
0.35
L1
0.30
0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
5X
0.49
6X
1.24
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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NLU2G17/D
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