參數(shù)資料
型號(hào): NLU2G16AMX1TCG
廠商: ON Semiconductor
文件頁(yè)數(shù): 8/10頁(yè)
文件大?。?/td> 0K
描述: IC BUFFER DUAL NON-INV 6ULLGA
標(biāo)準(zhǔn)包裝: 3,000
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相
元件數(shù): 2
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 8mA,8mA
電源電壓: 1.65 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-XFLGA
供應(yīng)商設(shè)備封裝: 6-ULLGA(1.45x1)
包裝: 帶卷 (TR)
NLU2G16
http://onsemi.com
7
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10
B
0.05
A
C
L
5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
1
3
4
6
DIM MIN
MAX
MILLIMETERS
A
0.45
0.55
A1
0.00
0.05
A3
0.127 REF
b
0.15
0.25
D
1.20 BSC
E
1.00 BSC
e
0.40 BSC
L
0.30
0.40
L1
0.00
0.15
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2
0.40
0.50
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42
6X
1.07
0.40
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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