參數(shù)資料
型號: NLAST4501DFT2G
廠商: ON SEMICONDUCTOR
元件分類: 多路復(fù)用及模擬開關(guān)
英文描述: Single SPST Analog Switch
中文描述: 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5
封裝: LEAD FREE, SC-88A, SOT-353, SC-70, 5 PIN
文件頁數(shù): 2/10頁
文件大?。?/td> 109K
代理商: NLAST4501DFT2G
NLAST4501
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Positive DC Supply Voltage
V
CC
0.5 to
7.0
V
Digital Input Voltage (Enable)
V
IN
0.5 to
7.0
V
Analog Output Voltage (V
NO
or V
COM
)
V
IS
0.5 to V
CC
0.5
V
DC Current, Into or Out of Any Pin
I
IK
20
mA
Storage Temperature Range
T
STG
65 to
150
C
Lead Temperature, 1 mm from Case for 10 Seconds
T
L
260
C
Junction Temperature under Bias
T
J
150
C
Thermal Resistance
SC705/SC88A (Note 1)
TSOP5
JA
350
230
C/W
Power Dissipation in Still Air at 85 C
SC705/SC88A
TSOP5
P
D
150
200
mW
Moisture Sensitivity
MSL
Level 1
Flammability Rating
Oxygen Index: 30% 35%
F
R
UL 94 V0 @ 0.125 in
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
ESD
> 2000
> 100
N/A
V
Latchup Performance
Above V
CC
and Below GND at 85 C (Note 5)
I
Latchup
300
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Max
Unit
Positive DC Supply Voltage
V
CC
2.0
5.5
V
Digital Input Voltage (Enable)
V
IN
GND
5.5
V
Static or Dynamic Voltage Across an Off Switch
V
IO
GND
V
CC
V
Analog Input Voltage (NO, COM)
V
IS
GND
V
CC
V
Operating Temperature Range, All Package Types
T
A
55
125
C
Input Rise or Fall Time,
(Enable Input)
V
cc
= 3.3 V
V
cc
= 5.0 V
0.3 V
0.5 V
t
r
, t
f
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature
°
C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
1
10
100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 2. Failure Rate vs. Time Junction Temperature
N
TIME, YEARS
T
J
T
J
T
J
T
J
T
J
T
J
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參數(shù)描述
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