參數(shù)資料
型號(hào): NLAS3799BMUR2G
廠商: ON Semiconductor
文件頁(yè)數(shù): 3/12頁(yè)
文件大?。?/td> 0K
描述: IC SWITCH DUAL DPDT 16UQFN
標(biāo)準(zhǔn)包裝: 1
功能: 開(kāi)關(guān)
電路: 2 x DPDT
導(dǎo)通狀態(tài)電阻: 400 毫歐
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.65 V ~ 4.5 V
電流 - 電源: 40µA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-UFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-UQFN(2.6x1.8)
包裝: 剪切帶 (CT)
其它名稱: NLAS3799BMUR2GOSCT
NLAS3799B, NLAS3799BL
http://onsemi.com
11
PACKAGE DIMENSIONS
WQFN16, 1.8x2.6, 0.4P
CASE 488AP01
ISSUE B
A
b
A3
A1
0.08 C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
DIM
MIN
MAX
MILLIMETERS
A
1.80 BSC
A1
0.40 BSC
A3
0.70
0.80
b
D
0.30
0.50
E
e
L
L1
0.20 REF
0.00
0.050
PIN 1 REFERENCE
D
A
E
B
0.15 C
2X
0.15 C
2X
0.10 C
C
L2
1
4
5
0.05 C
0.10 CA B
16 X
e
L
15 X
0.00
0.15
2.60 BSC
0.15
0.25
MOUNTING FOOTPRINT*
8
12
9
16
mm
inches
SCALE 20:1
1
0.400
0.0157
0.225
0.0089
0.463
0.0182
0.562
0.0221
2.900
0.1142
1.200
0.0472
2.100
0.0827
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
L2
0.40
0.60
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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