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參數(shù)資料
| 型號(hào)： | NLAS324USG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 3/10頁 |
| 文件大小： | 0K |
| 描述： | IC SWITCH DUAL SPST US8 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 功能： | 開關(guān) |
| 電路： | 2 x SPST - NC |
| 導(dǎo)通狀態(tài)電阻： | 30 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2.2 V ~ 5.5 V |
| 電流 - 電源： | 1µA |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-VFSOP（0.091"，2.30mm 寬） |
| 供應(yīng)商設(shè)備封裝： | US8 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | NLAS324USGOSDKR |
NLAS324
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
*0.5 to )7.0
V
VI
DC Input Voltage
*0.5 to )7.0
V
VO
DC Output Voltage
*0.5 to )7.0
V
IIK
DC Input Diode Current
VI < GND
*50
mA
IOK
DC Output Diode Current
VO < GND
*50
mA
IO
DC Output Sink Current
$50
mA
ICC
DC Supply Current per Supply Pin
$100
mA
IGND
DC Ground Current per Ground Pin
$100
mA
TSTG
Storage Temperature Range
*65 to )150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
_C
TJ
Junction Temperature under Bias
)150
_C
qJA
Thermal Resistance (Note 1)
250
_C/W
PD
Power Dissipation in Still Air at 85
_C
250
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 150
N/A
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
Positive DC Supply Voltage
2.0
5.5
V
VIN
Digital Input Voltage (Enable)
GND
5.5
V
VIO
Static or Dynamic Voltage Across an Off Switch
GND
VCC
V
VIS
Analog Input Voltage (NO, COM)
GND
VCC
V
TA
Operating Temperature Range, All Package Types
55
+125
°C
tr, tf
Input Rise or Fall Time,
Vcc = 3.3 V + 0.3 V
(Enable Input)
Vcc = 5.0 V + 0.5 V
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
Junction
Temperature
5C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
NORMALIZED
F
AILURE
RA
TE
1
10
100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 2. Failure Rate vs. Time Junction Temperature
TIME, YEARS
T
J=
1
3
0_
C
T
J=
1
2
0_
C
T
J=
1
0_
C
T
J=
1
0
0_
C
T
J=
9
0_
C
T
J=
8
0_
C
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| NLAS325US | 功能描述:模擬開關(guān) IC 2-6V Dual SPST Sw. RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| NLAS325USG | 功能描述:模擬開關(guān) IC 2-6V Dual SPST Sw. -55 to 125deg C RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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